HSEC8-160-01-L-DV-A-BL-TR Tech Spezifikatioune
Samtec Inc. - HSEC8-160-01-L-DV-A-BL-TR technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Samtec Inc. - HSEC8-160-01-L-DV-A-BL-TR
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | Samtec, Inc. | |
Terminatioun | Solder | |
Serie | Edge Rate™ HSEC8 | |
Liesen | Dual | |
Pitch | 0.031" (0.80mm) | |
Package protegéieren | Tape & Reel (TR) | |
Operatioun Temperatur | -55°C ~ 125°C | |
Zuel vun Zeilen | 2 | |
Zuel vun Positiounen / Bay / Row | 60 | |
Unzuel vun Positionen | 120 | |
Mounting Type | Surface Mount | |
Material - Isolatioun | Liquid Crystal Polymer (LCP) |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Geschlecht | Female | |
Flange Feature | - | |
Eegeschaften | Board Guide, Board Lock | |
Kontakttyp | Cantilever | |
Kontakt Material | Beryllium Copper | |
Kontaktéiert Finish Thickness | 10.0µin (0.25µm) | |
Kontaktéieren | Gold | |
Faarf | Black | |
Card Type | Non Specified - Dual Edge | |
Card Thickness | 0.062" (1.57mm) | |
Basis Produktnummer | HSEC8-160 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Samtec Inc. HSEC8-160-01-L-DV-A-BL-TR.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | HSEC8-160-01-L-DV-A-BL-TR | 1871058-4 | 2331813-2 | HSEC8-120-01-L-DV-A-PE-K |
Hiersteller | Samtec Inc. | TE Connectivity AMP Connectors | TE Connectivity AMP Connectors | Samtec Inc. |
Package protegéieren | Tape & Reel (TR) | Bulk | Tape & Reel (TR) | Tray |
Geschlecht | Female | Female | Female | Female |
Kontakt Material | Beryllium Copper | Copper Alloy | Copper Alloy | Beryllium Copper |
Kontakttyp | Cantilever | - | - | Cantilever |
Eegeschaften | Board Guide, Board Lock | Board Guide, Locking Ramp | Board Guide, Pick and Place, Solder Retention | Board Guide |
Kontaktéieren | Gold | Gold-Palladium | Gold | Gold |
Zuel vun Positiounen / Bay / Row | 60 | - | 28; 14 | 20 |
Faarf | Black | Black | Black | Black |
Flange Feature | - | - | - | - |
Material - Isolatioun | Liquid Crystal Polymer (LCP) | Thermoplastic | Liquid Crystal Polymer (LCP) | Liquid Crystal Polymer (LCP) |
Liesen | Dual | Dual | Dual | Dual |
Zuel vun Zeilen | 2 | 2 | 2 | 2 |
Mounting Type | Surface Mount | Through Hole | Surface Mount | Surface Mount |
Unzuel vun Positionen | 120 | 164 | 84 | 40 |
Basis Produktnummer | HSEC8-160 | 1871058 | 2331813 | HSEC8-120 |
Operatioun Temperatur | -55°C ~ 125°C | -55°C ~ 85°C | -55°C ~ 85°C | -55°C ~ 125°C |
Pitch | 0.031" (0.80mm) | 0.039" (1.00mm) | 0.024" (0.60mm) | 0.031" (0.80mm) |
Card Thickness | 0.062" (1.57mm) | 0.062" (1.57mm) | 0.062" (1.57mm) | 0.062" (1.57mm) |
Card Type | Non Specified - Dual Edge | PCI Express™ | Non Specified - Dual Edge | Non Specified - Dual Edge |
Terminatioun | Solder | Press-Fit | Solder | Solder |
Serie | Edge Rate™ HSEC8 | - | Sliver 2.0 | Edge Rate™ HSEC8 |
Kontaktéiert Finish Thickness | 10.0µin (0.25µm) | 30.0µin (0.76µm) | 15.0µin (0.38µm) | 10.0µin (0.25µm) |
Eroflueden HSEC8-160-01-L-DV-A-BL-TR PDF DataDhusts an Samtec Inc. Dokumentatioun fir HSEC8-160-01-L-DV-A-BL-TR - Samtec Inc..
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
---|---|
Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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