HSEC8-110-01-S-DV-A-K-TR Tech Spezifikatioune
Samtec Inc. - HSEC8-110-01-S-DV-A-K-TR technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Samtec Inc. - HSEC8-110-01-S-DV-A-K-TR
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | Samtec, Inc. | |
Terminatioun | Solder | |
Serie | Edge Rate™ HSEC8 | |
Liesen | Dual | |
Pitch | 0.031' (0.80mm) | |
Package protegéieren | Tape & Reel (TR) | |
Operatioun Temperatur | -55°C ~ 125°C | |
Zuel vun Zeilen | 2 | |
Zuel vun Positiounen / Bay / Row | 10 | |
Unzuel vun Positionen | 20 | |
Mounting Type | Surface Mount | |
Material - Isolatioun | Liquid Crystal Polymer (LCP) |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Geschlecht | Female | |
Flange Feature | - | |
Eegeschaften | Board Guide, Locking Ramp | |
Kontakttyp | Cantilever | |
Kontakt Material | Beryllium Copper | |
Kontaktéiert Finish Thickness | 30.0µin (0.76µm) | |
Kontaktéieren | Gold | |
Faarf | Black | |
Card Type | Non Specified - Dual Edge | |
Card Thickness | 0.062' (1.57mm) | |
Basis Produktnummer | HSEC8-110 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Samtec Inc. HSEC8-110-01-S-DV-A-K-TR.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | HSEC8-110-01-S-DV-A-K-TR | HSEC8-160-01-S-DV-A | HSEC8-1100-01-L-DV-A-BL-K | 1871058-3 |
Hiersteller | Samtec Inc. | Samtec Inc. | Samtec Inc. | TE Connectivity AMP Connectors |
Mounting Type | Surface Mount | Surface Mount | Surface Mount | Through Hole |
Basis Produktnummer | HSEC8-110 | HSEC8-160 | HSEC8-1100 | 1871058 |
Zuel vun Positiounen / Bay / Row | 10 | - | 100 | - |
Kontaktéieren | Gold | Gold | Gold | Gold-Palladium |
Zuel vun Zeilen | 2 | 2 | 2 | 2 |
Faarf | Black | Black | Black | Black |
Package protegéieren | Tape & Reel (TR) | Tray | Tray | Bulk |
Material - Isolatioun | Liquid Crystal Polymer (LCP) | Liquid Crystal Polymer (LCP) | Liquid Crystal Polymer (LCP) | Thermoplastic |
Liesen | Dual | Dual | Dual | Dual |
Kontakttyp | Cantilever | - | Cantilever | - |
Card Type | Non Specified - Dual Edge | Non Specified - Dual Edge | Non Specified - Dual Edge | PCI Express™ |
Terminatioun | Solder | Solder | Solder | Press-Fit |
Geschlecht | Female | Female | Female | Female |
Flange Feature | - | - | - | - |
Unzuel vun Positionen | 20 | 120 | 200 | 98 |
Eegeschaften | Board Guide, Locking Ramp | Board Guide | Board Guide, Board Lock | Board Guide, Locking Ramp |
Kontaktéiert Finish Thickness | 30.0µin (0.76µm) | 30.0µin (0.76µm) | 10.0µin (0.25µm) | 30.0µin (0.76µm) |
Operatioun Temperatur | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 85°C |
Kontakt Material | Beryllium Copper | Beryllium Copper | Beryllium Copper | Copper Alloy |
Serie | Edge Rate™ HSEC8 | Edge Rate™ HSEC8 | Edge Rate™ HSEC8 | - |
Pitch | 0.031' (0.80mm) | 0.031' (0.80mm) | 0.031" (0.80mm) | 0.039" (1.00mm) |
Card Thickness | 0.062' (1.57mm) | 0.062' (1.57mm) | 0.062" (1.57mm) | 0.062" (1.57mm) |
Eroflueden HSEC8-110-01-S-DV-A-K-TR PDF DataDhusts an Samtec Inc. Dokumentatioun fir HSEC8-110-01-S-DV-A-K-TR - Samtec Inc..
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
---|---|
Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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