10061913-100PLF Tech Spezifikatioune
Amphenol ICC (FCI) - 10061913-100PLF technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Amphenol ICC (FCI) - 10061913-100PLF
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | Amphenol Aorora | |
| Terminatioun | Solder | |
| Serie | - | |
| Liesen | Dual | |
| Pitch | 0.039' (1.00mm) | |
| Package protegéieren | Tape & Reel (TR) | |
| Operatioun Temperatur | -55°C ~ 85°C | |
| Zuel vun Zeilen | 2 | |
| Zuel vun Positiounen / Bay / Row | - | |
| Unzuel vun Positionen | 36 | |
| Mounting Type | Surface Mount | |
| Material - Isolatioun | Polyamide (PA), Nylon, Glass Filled |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Geschlecht | Female | |
| Flange Feature | - | |
| Eegeschaften | Board Guide, Locking Ramp, Pick and Place, Solder Retention | |
| Kontakttyp | Cantilever | |
| Kontakt Material | Copper Alloy | |
| Kontaktéiert Finish Thickness | 30.0µin (0.76µm) | |
| Kontaktéieren | Gold | |
| Faarf | Black | |
| Card Type | PCI Express™ | |
| Card Thickness | 0.062' (1.57mm) | |
| Basis Produktnummer | 10061913 |
| ATTRESSIOUN | BESCHREIWUNG |
|---|---|
| RoHs Status | RoHS konform |
| Fiichtegkeet Sensibilitéitsniveau (MSL) | 1 (Unlimited) |
| Erreecht Status | REACH Affected |
| ECCN | EAR99 |
| HTSUS | 8536.69.4040 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Amphenol ICC (FCI) 10061913-100PLF.
| Produktiounsattriff |  |
 |
 |
 |
|---|---|---|---|---|
| Part Number | 10061913-100PLF | 10061913-101CLF | 10061913-101PLF | 10061913-102CLF |
| Hiersteller | Amphenol ICC (FCI) | Amphenol ICC (FCI) | Amphenol ICC (FCI) | Amphenol ICC (FCI) |
| Zuel vun Zeilen | 2 | 2 | 2 | 2 |
| Geschlecht | Female | Female | Female | Female |
| Pitch | 0.039' (1.00mm) | 0.039" (1.00mm) | 0.039" (1.00mm) | 0.039" (1.00mm) |
| Unzuel vun Positionen | 36 | 64 | 64 | 98 |
| Kontakt Material | Copper Alloy | Copper Alloy | Copper Alloy | Copper Alloy |
| Kontaktéieren | Gold | Gold | Gold | Gold |
| Package protegéieren | Tape & Reel (TR) | Tray | Tape & Reel (TR) | Tray |
| Flange Feature | - | - | - | - |
| Zuel vun Positiounen / Bay / Row | - | 11; 21 | - | - |
| Faarf | Black | Black | Black | Black |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Card Type | PCI Express™ | PCI Express™ | PCI Express™ | PCI Express™ |
| Serie | - | - | - | - |
| Eegeschaften | Board Guide, Locking Ramp, Pick and Place, Solder Retention | Board Guide, Locking Ramp, Pick and Place, Solder Retention | Board Guide, Locking Ramp, Pick and Place, Solder Retention | Board Guide, Locking Ramp, Pick and Place, Solder Retention |
| Liesen | Dual | Dual | Dual | Dual |
| Material - Isolatioun | Polyamide (PA), Nylon, Glass Filled | Polyamide (PA), Nylon, Glass Filled | Polyamide (PA), Nylon, Glass Filled | Polyamide (PA), Nylon, Glass Filled |
| Card Thickness | 0.062' (1.57mm) | 0.062" (1.57mm) | 0.062" (1.57mm) | 0.062" (1.57mm) |
| Basis Produktnummer | 10061913 | 10061913 | 10061913 | 10061913 |
| Kontaktéiert Finish Thickness | 30.0µin (0.76µm) | 30.0µin (0.76µm) | 30.0µin (0.76µm) | 30.0µin (0.76µm) |
| Terminatioun | Solder | Solder | Solder | Solder |
| Kontakttyp | Cantilever | Cantilever | Cantilever | Cantilever |
| Operatioun Temperatur | -55°C ~ 85°C | -55°C ~ 85°C | -55°C ~ 85°C | -55°C ~ 85°C |
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10061122-251120HLFAmphenol ICC (FCI)CONN FPC BOTTOM 25POS 0.3MM R/A| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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