IRF5806TRPBF Tech Spezifikatioune
Infineon Technologies - IRF5806TRPBF technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Infineon Technologies - IRF5806TRPBF
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | Infineon Technologies | |
Vgs (th) (Max) @ Id | 1.2V @ 250µA | |
Vgs (Max) | ±20V | |
Technologie | MOSFET (Metal Oxide) | |
Supplier Device Package | Micro6™(TSOP-6) | |
Serie | HEXFET® | |
Rds On (Max) @ Id, Vgs | 86mOhm @ 4A, 4.5V | |
Power Dissipation (Max) | 2W (Ta) | |
Package / Case | SOT-23-6 Thin, TSOT-23-6 | |
Package protegéieren | Tape & Reel (TR) |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Operatioun Temperatur | -55°C ~ 150°C (TJ) | |
Mounting Type | Surface Mount | |
Input Capacitance (Ciss) (Max) @ Vds | 594 pF @ 15 V | |
Gate Charge (Qg) (Max) @ Vgs | 11.4 nC @ 4.5 V | |
FET Typ | P-Channel | |
FET Feature | - | |
Fuert Volt (Max Rds On, Min Rds On) | 2.5V, 4.5V | |
Entworf fir Source Voltage (Vdss) | 20 V | |
Aktuell - Kontinuéierter Drain (Id) @ 25 ° C | 4A (Ta) |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Infineon Technologies IRF5806TRPBF.
Produktiounsattriff | ||||
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Part Number | IRF5806TRPBF | IRF5803TRPBF | IRF5803TR | IRF5804TRPBF |
Hiersteller | Infineon Technologies | Infineon Technologies | Infineon Technologies | Infineon Technologies |
Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Package / Case | SOT-23-6 Thin, TSOT-23-6 | SOT-23-6 Thin, TSOT-23-6 | SOT-23-6 Thin, TSOT-23-6 | SOT-23-6 Thin, TSOT-23-6 |
Aktuell - Kontinuéierter Drain (Id) @ 25 ° C | 4A (Ta) | 3.4A (Ta) | 3.4A (Ta) | 2.5A (Ta) |
Vgs (th) (Max) @ Id | 1.2V @ 250µA | 3V @ 250µA | 3V @ 250µA | 3V @ 250µA |
Package protegéieren | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) |
FET Feature | - | - | - | - |
Vgs (Max) | ±20V | ±20V | ±20V | ±20V |
Technologie | MOSFET (Metal Oxide) | MOSFET (Metal Oxide) | MOSFET (Metal Oxide) | MOSFET (Metal Oxide) |
Fuert Volt (Max Rds On, Min Rds On) | 2.5V, 4.5V | 4.5V, 10V | 4.5V, 10V | 4.5V, 10V |
FET Typ | P-Channel | P-Channel | P-Channel | P-Channel |
Operatioun Temperatur | -55°C ~ 150°C (TJ) | -55°C ~ 150°C (TJ) | -55°C ~ 150°C (TJ) | -55°C ~ 150°C (TJ) |
Entworf fir Source Voltage (Vdss) | 20 V | 40 V | 40 V | 40 V |
Power Dissipation (Max) | 2W (Ta) | 2W (Ta) | 2W (Ta) | 2W (Ta) |
Supplier Device Package | Micro6™(TSOP-6) | Micro6™(TSOP-6) | Micro6™(TSOP-6) | Micro6™(TSOP-6) |
Gate Charge (Qg) (Max) @ Vgs | 11.4 nC @ 4.5 V | 37 nC @ 10 V | 37 nC @ 10 V | 8.5 nC @ 10 V |
Serie | HEXFET® | HEXFET® | HEXFET® | HEXFET® |
Input Capacitance (Ciss) (Max) @ Vds | 594 pF @ 15 V | 1110 pF @ 25 V | 1110 pF @ 25 V | 680 pF @ 25 V |
Rds On (Max) @ Id, Vgs | 86mOhm @ 4A, 4.5V | 112mOhm @ 3.4A, 10V | 112mOhm @ 3.4A, 10V | 198mOhm @ 2.5A, 10V |
Eroflueden IRF5806TRPBF PDF DataDhusts an Infineon Technologies Dokumentatioun fir IRF5806TRPBF - Infineon Technologies.
Allgemeng Länner Login logistesch Zäit Referenz | ||
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Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
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Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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