MC9RS08KA2CDB Tech Spezifikatioune
NXP USA Inc. - MC9RS08KA2CDB technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu NXP USA Inc. - MC9RS08KA2CDB
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | NXP Semiconductors | |
Voltage - Versorgung (Vcc / Vdd) | 1.8V ~ 5.5V | |
Supplier Device Package | 6-DFN-EP (3x3) | |
Speed | 10MHz | |
Serie | RS08 | |
RAM Gréisst | 63 x 8 | |
Programm Memory Type | FLASH | |
Programmspeichergréisst | 2KB (2K x 8) | |
Peripheralien | LVD, POR, WDT | |
Package / Case | 6-VDFN Exposed Pad | |
Package protegéieren | Tray |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Oszilléierertyp | Internal | |
Operatioun Temperatur | -40°C ~ 85°C (TA) | |
Zuel vun I / O | 2 | |
Mounting Type | Surface Mount | |
EEPROM Gréisst | - | |
Datenkonverter | - | |
Core Size | 8-Bit | |
Core Prozessor | RS08 | |
Konnektivitéit | - | |
Basis Produktnummer | MC9RS08 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu NXP USA Inc. MC9RS08KA2CDB.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | MC9RS08KA2CDB | MC9RS08KA1CSC | MC9RS08KA4CWG | MC9RS08KA1CDBR |
Hiersteller | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. | Freescale Semiconductor |
Speed | 10MHz | 10MHz | 20MHz | 10MHz |
Package protegéieren | Tray | Tube | Tube | Bulk |
Basis Produktnummer | MC9RS08 | MC9RS08 | MC9RS08 | MC9RS08 |
Package / Case | 6-VDFN Exposed Pad | 8-SOIC (0.154", 3.90mm Width) | 16-SOIC (0.295', 7.50mm Width) | 6-VDFN Exposed Pad |
EEPROM Gréisst | - | - | - | - |
Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Serie | RS08 | RS08 | RS08 | RS08 |
Oszilléierertyp | Internal | Internal | Internal | Internal |
Datenkonverter | - | - | A/D 12x10b | - |
Core Prozessor | RS08 | RS08 | RS08 | RS08 |
RAM Gréisst | 63 x 8 | 63 x 8 | 126 x 8 | 63 x 8 |
Programm Memory Type | FLASH | FLASH | FLASH | FLASH |
Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
Voltage - Versorgung (Vcc / Vdd) | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 1.8V ~ 5.5V |
Peripheralien | LVD, POR, WDT | LVD, POR, WDT | LVD, POR, PWM, WDT | LVD, POR, WDT |
Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
Supplier Device Package | 6-DFN-EP (3x3) | 8-SOIC | 16-SOIC | 6-DFN-EP (3x3) |
Programmspeichergréisst | 2KB (2K x 8) | 1KB (1K x 8) | 4KB (4K x 8) | 1KB (1K x 8) |
Zuel vun I / O | 2 | 4 | 14 | 2 |
Konnektivitéit | - | - | I²C | - |
Eroflueden MC9RS08KA2CDB PDF DataDhusts an NXP USA Inc. Dokumentatioun fir MC9RS08KA2CDB - NXP USA Inc..
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
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Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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