MC9RS08KA1CPC Tech Spezifikatioune
NXP USA Inc. - MC9RS08KA1CPC technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu NXP USA Inc. - MC9RS08KA1CPC
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | NXP Semiconductors | |
| Voltage - Versorgung (Vcc / Vdd) | 1.8V ~ 5.5V | |
| Supplier Device Package | 8-PDIP | |
| Speed | 10MHz | |
| Serie | RS08 | |
| RAM Gréisst | 63 x 8 | |
| Programm Memory Type | FLASH | |
| Programmspeichergréisst | 1KB (1K x 8) | |
| Peripheralien | LVD, POR, WDT | |
| Package / Case | 8-DIP (0.300', 7.62mm) | |
| Package protegéieren | Tube |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Oszilléierertyp | Internal | |
| Operatioun Temperatur | -40°C ~ 85°C (TA) | |
| Zuel vun I / O | 4 | |
| Mounting Type | Through Hole | |
| EEPROM Gréisst | - | |
| Datenkonverter | - | |
| Core Size | 8-Bit | |
| Core Prozessor | RS08 | |
| Konnektivitéit | - | |
| Basis Produktnummer | MC9RS08 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu NXP USA Inc. MC9RS08KA1CPC.
| Produktiounsattriff |  |
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|---|---|---|---|---|
| Part Number | MC9RS08KA1CPC | MC9RS08KA1CSCR | MC9RS08KA4CTG | MC9RS08KA1CSC |
| Hiersteller | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. |
| Voltage - Versorgung (Vcc / Vdd) | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 1.8V ~ 5.5V |
| Package protegéieren | Tube | Tape & Reel (TR) | Tube | Tube |
| Mounting Type | Through Hole | Surface Mount | Surface Mount | Surface Mount |
| Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Oszilléierertyp | Internal | Internal | Internal | Internal |
| RAM Gréisst | 63 x 8 | 63 x 8 | 126 x 8 | 63 x 8 |
| Datenkonverter | - | - | A/D 12x10b | - |
| Basis Produktnummer | MC9RS08 | MC9RS08 | MC9RS08 | MC9RS08 |
| Zuel vun I / O | 4 | 4 | 14 | 4 |
| Programmspeichergréisst | 1KB (1K x 8) | 1KB (1K x 8) | 4KB (4K x 8) | 1KB (1K x 8) |
| Peripheralien | LVD, POR, WDT | LVD, POR, WDT | LVD, POR, PWM, WDT | LVD, POR, WDT |
| Supplier Device Package | 8-PDIP | 8-SOIC | 16-TSSOP | 8-SOIC |
| Speed | 10MHz | 10MHz | 20MHz | 10MHz |
| Konnektivitéit | - | - | I²C | - |
| Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
| Programm Memory Type | FLASH | FLASH | FLASH | FLASH |
| EEPROM Gréisst | - | - | - | - |
| Serie | RS08 | RS08 | RS08 | RS08 |
| Core Prozessor | RS08 | RS08 | RS08 | RS08 |
| Package / Case | 8-DIP (0.300', 7.62mm) | 8-SOIC (0.154", 3.90mm Width) | 16-TSSOP (0.173', 4.40mm Width) | 8-SOIC (0.154", 3.90mm Width) |
Eroflueden MC9RS08KA1CPC PDF DataDhusts an NXP USA Inc. Dokumentatioun fir MC9RS08KA1CPC - NXP USA Inc..
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MC9RS08KA1CDBFreescale SemiconductorIC MCU 8BIT 1KB FLASH 6DFN
MC9RS08KA1CDBRFreescale SemiconductorIC MCU 8BIT 1KB FLASH 6DFNMC9L05AMOTOROLAMC9RS08KA2CSCNXP USA Inc.IC MCU 8BIT 2KB FLASH 8SOICMC9RS08KA2CPCNXP USA Inc.IC MCU 8BIT 2KB FLASH 8DIP
MC9RS08KA2CDBNXP USA Inc.IC MCU 8BIT 2KB FLASH 6DFNMC9RS08KA2CSCRNXP USA Inc.IC MCU 8BIT 2KB FLASH 8SOICMC9C08QG4CFKEFreescale / NXP SemiconductorsMC9RS08KA1CDBNXP USA Inc.IC MCU 8BIT 1KB FLASH 6DFN
MC9RS08KA4CPGNXP USA Inc.IC MCU 8BIT 4KB FLASH 16DIPMC9RS08KA1CDBRNXP USA Inc.IC MCU 8BIT 1KB FLASH 6DFN| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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