LPC1311FHN33 Tech Spezifikatioune
NXP USA Inc. - LPC1311FHN33 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu NXP USA Inc. - LPC1311FHN33
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | NXP Semiconductors | |
| Voltage - Versorgung (Vcc / Vdd) | 2V ~ 3.6V | |
| Supplier Device Package | 32-HVQFN (7x7) | |
| Speed | 72MHz | |
| Serie | LPC13xx | |
| RAM Gréisst | 4K x 8 | |
| Programm Memory Type | FLASH | |
| Programmspeichergréisst | 8KB (8K x 8) | |
| Peripheralien | Brown-out Detect/Reset, POR, WDT | |
| Package / Case | 32-VQFN Exposed Pad | |
| Package protegéieren | Bulk |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Oszilléierertyp | Internal | |
| Operatioun Temperatur | -40°C ~ 85°C (TA) | |
| Zuel vun I / O | 28 | |
| Mounting Type | Surface Mount | |
| EEPROM Gréisst | - | |
| Datenkonverter | A/D 8x10b | |
| Core Size | 32-Bit Single-Core | |
| Core Prozessor | ARM® Cortex®-M3 | |
| Konnektivitéit | I²C, Microwire, SPI, SSI, UART/USART | |
| Basis Produktnummer | LPC1311 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu NXP USA Inc. LPC1311FHN33.
| Produktiounsattriff |  |
 |
 |
|
|---|---|---|---|---|
| Part Number | LPC1311FHN33 | LPC12D27FBD100/301 | LPC1313FHN33/01 | LPC12D27FBD100-301 |
| Hiersteller | NXP USA Inc. | NXP USA Inc. | Freescale / NXP Semiconductors | Freescale / NXP Semiconductors |
| Peripheralien | Brown-out Detect/Reset, POR, WDT | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | - | - |
| Supplier Device Package | 32-HVQFN (7x7) | 100-LQFP (14x14) | - | - |
| Serie | LPC13xx | LPC1200 | - | - |
| Voltage - Versorgung (Vcc / Vdd) | 2V ~ 3.6V | 3V ~ 3.6V | - | - |
| Core Size | 32-Bit Single-Core | 32-Bit Single-Core | - | - |
| Package / Case | 32-VQFN Exposed Pad | 100-LQFP | - | - |
| Speed | 72MHz | 45MHz | - | - |
| Package protegéieren | Bulk | Tray | - | - |
| Programmspeichergréisst | 8KB (8K x 8) | 128KB (128K x 8) | - | - |
| Basis Produktnummer | LPC1311 | LPC12 | - | - |
| Konnektivitéit | I²C, Microwire, SPI, SSI, UART/USART | I²C, IrDA, SPI, SSP, UART/USART | - | - |
| EEPROM Gréisst | - | - | - | - |
| Zuel vun I / O | 28 | 40 | - | - |
| Mounting Type | Surface Mount | Surface Mount | - | - |
| Programm Memory Type | FLASH | FLASH | - | - |
| Datenkonverter | A/D 8x10b | A/D 8x10b | - | - |
| Oszilléierertyp | Internal | Internal | - | - |
| Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | - | - |
| RAM Gréisst | 4K x 8 | 8K x 8 | - | - |
| Core Prozessor | ARM® Cortex®-M3 | ARM® Cortex®-M0 | - | - |
LPC1313FHN33/01Freescale / NXP SemiconductorsLPC12D27FBD100-301Freescale / NXP SemiconductorsLPC1311FHNFreescale / NXP SemiconductorsLPC1313FHN33/0155NXP SemiconductorsLPC1227FBD48/301ELNXP SemiconductorsLPC1227FBD64/301,1NXP SemiconductorsLPC1313FHN33Freescale / NXP SemiconductorsLPC1313FHN33,551NXP SemiconductorsLPC1313FBD48/01,15NXP SemiconductorsLPC1313FBD48Freescale / NXP SemiconductorsLPC1227FBD48/3011NXP SemiconductorsLPC1227FBD64Freescale / NXP SemiconductorsLPC1227FBD48/301Freescale / NXP SemiconductorsLPC1227FBD64/301Freescale / NXP SemiconductorsLPC12D27FBD100/301NXP USA Inc.IC MCU 32BIT 128KB FLASH 100LQFPLPC1313FHN33/551NXP SemiconductorsLPC1313FBD48/01NXP Semiconductors
LPC1311FHN33551| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
Wëllt Dir e bessere Präis? A WED AN AMFE NEW, MELLT DIR DIR NËMMEN.