LPC12D27FBD100/301 Tech Spezifikatioune
NXP USA Inc. - LPC12D27FBD100/301 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu NXP USA Inc. - LPC12D27FBD100/301
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | NXP Semiconductors | |
| Voltage - Versorgung (Vcc / Vdd) | 3V ~ 3.6V | |
| Supplier Device Package | 100-LQFP (14x14) | |
| Speed | 45MHz | |
| Serie | LPC1200 | |
| RAM Gréisst | 8K x 8 | |
| Programm Memory Type | FLASH | |
| Programmspeichergréisst | 128KB (128K x 8) | |
| Peripheralien | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | |
| Package / Case | 100-LQFP | |
| Package protegéieren | Tray |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Oszilléierertyp | Internal | |
| Operatioun Temperatur | -40°C ~ 85°C (TA) | |
| Zuel vun I / O | 40 | |
| Mounting Type | Surface Mount | |
| EEPROM Gréisst | - | |
| Datenkonverter | A/D 8x10b | |
| Core Size | 32-Bit Single-Core | |
| Core Prozessor | ARM® Cortex®-M0 | |
| Konnektivitéit | I²C, IrDA, SPI, SSP, UART/USART | |
| Basis Produktnummer | LPC12 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu NXP USA Inc. LPC12D27FBD100/301.
| Produktiounsattriff |  |
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 |
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|---|---|---|---|---|
| Part Number | LPC12D27FBD100/301 | LPC1311FHN33 | LPC1311FHN | LPC1313FBD48 |
| Hiersteller | NXP USA Inc. | NXP USA Inc. | Freescale / NXP Semiconductors | Freescale / NXP Semiconductors |
| Oszilléierertyp | Internal | Internal | - | - |
| Konnektivitéit | I²C, IrDA, SPI, SSP, UART/USART | I²C, Microwire, SPI, SSI, UART/USART | - | - |
| EEPROM Gréisst | - | - | - | - |
| Zuel vun I / O | 40 | 28 | - | - |
| Peripheralien | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT | Brown-out Detect/Reset, POR, WDT | - | - |
| Core Size | 32-Bit Single-Core | 32-Bit Single-Core | - | - |
| Voltage - Versorgung (Vcc / Vdd) | 3V ~ 3.6V | 2V ~ 3.6V | - | - |
| Datenkonverter | A/D 8x10b | A/D 8x10b | - | - |
| Basis Produktnummer | LPC12 | LPC1311 | - | - |
| Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | - | - |
| Programmspeichergréisst | 128KB (128K x 8) | 8KB (8K x 8) | - | - |
| Core Prozessor | ARM® Cortex®-M0 | ARM® Cortex®-M3 | - | - |
| Supplier Device Package | 100-LQFP (14x14) | 32-HVQFN (7x7) | - | - |
| Mounting Type | Surface Mount | Surface Mount | - | - |
| Serie | LPC1200 | LPC13xx | - | - |
| RAM Gréisst | 8K x 8 | 4K x 8 | - | - |
| Programm Memory Type | FLASH | FLASH | - | - |
| Package protegéieren | Tray | Bulk | - | - |
| Speed | 45MHz | 72MHz | - | - |
| Package / Case | 100-LQFP | 32-VQFN Exposed Pad | - | - |
Eroflueden LPC12D27FBD100/301 PDF DataDhusts an NXP USA Inc. Dokumentatioun fir LPC12D27FBD100/301 - NXP USA Inc..
LPC1311FHNFreescale / NXP SemiconductorsLPC1313FBD48Freescale / NXP Semiconductors
LPC1311FHN33551LPC1227FBD48/301ELNXP SemiconductorsLPC1313FHN33Freescale / NXP SemiconductorsLPC1313FBD48/01NXP SemiconductorsLPC12D27FBD100-301Freescale / NXP SemiconductorsLPC1227FBD48NXP SemiconductorsLPC1227F1AFreescale / NXP SemiconductorsLPC1227FBD64/301,1NXP SemiconductorsLPC1311FHN33NXP USA Inc.IC MCU 32BIT 8KB FLASH 32HVQFNLPC1313FHN33,551NXP SemiconductorsLPC1227FBD48/3011NXP SemiconductorsLPC1313FHN33/01Freescale / NXP SemiconductorsLPC1313FBD48/01,15NXP SemiconductorsLPC1227FBD64Freescale / NXP SemiconductorsLPC1227FBD48/301Freescale / NXP SemiconductorsLPC1227FBD64/301Freescale / NXP Semiconductors| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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