XAZU3EG-1SFVA625I Tech Spezifikatioune
AMD - XAZU3EG-1SFVA625I technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu AMD - XAZU3EG-1SFVA625I
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | AMD Xilinx | |
Supplier Device Package | 625-FCBGA (21x21) | |
Speed | 500MHz, 1.2GHz | |
Serie | Zynq® UltraScale+™ MPSoC EG | |
RAM Gréisst | 1.8MB | |
Primäre Attributer | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | |
Peripheralien | DMA, WDT | |
Package / Case | 625-BFBGA, FCBGA |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Package protegéieren | Tray | |
Operatioun Temperatur | -40°C ~ 100°C (TJ) | |
Zuel vun I / O | 128 | |
Flash Size | - | |
Core Prozessor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | |
Konnektivitéit | CANbus, I²C, SPI, UART/USART, USB | |
Basis Produktnummer | XAZU3 | |
Architektur | MPU, FPGA |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu AMD XAZU3EG-1SFVA625I.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | XAZU3EG-1SFVA625I | M2S150TS-1FCG1152 | XAZU3EG-1SFVC784Q | XC7Z020-2CLG484I |
Hiersteller | AMD | Microchip Technology | AMD | AMD |
Architektur | MPU, FPGA | MCU, FPGA | MPU, FPGA | MCU, FPGA |
Package / Case | 625-BFBGA, FCBGA | 1152-BBGA, FCBGA | 784-BFBGA, FCBGA | 484-LFBGA, CSPBGA |
Flash Size | - | 512KB | - | - |
Basis Produktnummer | XAZU3 | M2S150 | XAZU3 | XC7Z020 |
Peripheralien | DMA, WDT | DDR, PCIe, SERDES | DMA, WDT | DMA |
Zuel vun I / O | 128 | 574 | 128 | 130 |
Konnektivitéit | CANbus, I²C, SPI, UART/USART, USB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | CANbus, I²C, SPI, UART/USART, USB | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Package protegéieren | Tray | Tray | Tray | Tray |
Serie | Zynq® UltraScale+™ MPSoC EG | SmartFusion®2 | Zynq® UltraScale+™ MPSoC EG | Zynq®-7000 |
Operatioun Temperatur | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) | -40°C ~ 125°C (TJ) | -40°C ~ 100°C (TJ) |
Primäre Attributer | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | FPGA - 150K Logic Modules | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | Artix™-7 FPGA, 85K Logic Cells |
Speed | 500MHz, 1.2GHz | 166MHz | 500MHz, 1.2GHz | 766MHz |
Core Prozessor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | ARM® Cortex®-M3 | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Supplier Device Package | 625-FCBGA (21x21) | 1152-FCBGA (35x35) | 784-FCBGA (23x23) | 484-CSPBGA (19x19) |
RAM Gréisst | 1.8MB | 64KB | 1.8MB | 256KB |
Eroflueden XAZU3EG-1SFVA625I PDF DataDhusts an AMD Dokumentatioun fir XAZU3EG-1SFVA625I - AMD.
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
---|---|
Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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