XAZU3EG-1SFVC784Q Tech Spezifikatioune
AMD - XAZU3EG-1SFVC784Q technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu AMD - XAZU3EG-1SFVC784Q
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | AMD Xilinx | |
Supplier Device Package | 784-FCBGA (23x23) | |
Speed | 500MHz, 1.2GHz | |
Serie | Zynq® UltraScale+™ MPSoC EG | |
RAM Gréisst | 1.8MB | |
Primäre Attributer | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | |
Peripheralien | DMA, WDT | |
Package / Case | 784-BFBGA, FCBGA |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Package protegéieren | Tray | |
Operatioun Temperatur | -40°C ~ 125°C (TJ) | |
Zuel vun I / O | 128 | |
Flash Size | - | |
Core Prozessor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | |
Konnektivitéit | CANbus, I²C, SPI, UART/USART, USB | |
Basis Produktnummer | XAZU3 | |
Architektur | MPU, FPGA |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu AMD XAZU3EG-1SFVC784Q.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | XAZU3EG-1SFVC784Q | XAZU4EV-1SFVC784I | 5CSEBA4U19C8SN | XAZU3EG-1SFVA625I |
Hiersteller | AMD | AMD | Intel | AMD |
Basis Produktnummer | XAZU3 | - | - | XAZU3 |
Package / Case | 784-BFBGA, FCBGA | - | 484-FBGA | 625-BFBGA, FCBGA |
Speed | 500MHz, 1.2GHz | - | 600MHz | 500MHz, 1.2GHz |
Operatioun Temperatur | -40°C ~ 125°C (TJ) | - | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
Serie | Zynq® UltraScale+™ MPSoC EG | - | Cyclone® V SE | Zynq® UltraScale+™ MPSoC EG |
Architektur | MPU, FPGA | - | MCU, FPGA | MPU, FPGA |
Konnektivitéit | CANbus, I²C, SPI, UART/USART, USB | - | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | CANbus, I²C, SPI, UART/USART, USB |
Peripheralien | DMA, WDT | - | DMA, POR, WDT | DMA, WDT |
RAM Gréisst | 1.8MB | - | 64KB | 1.8MB |
Core Prozessor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Package protegéieren | Tray | - | Tray | Tray |
Supplier Device Package | 784-FCBGA (23x23) | - | 484-UBGA (19x19) | 625-FCBGA (21x21) |
Flash Size | - | - | - | - |
Primäre Attributer | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | FPGA - 40K Logic Elements | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
Zuel vun I / O | 128 | - | MCU - 151, FPGA - 66 | 128 |
Eroflueden XAZU3EG-1SFVC784Q PDF DataDhusts an AMD Dokumentatioun fir XAZU3EG-1SFVC784Q - AMD.
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
---|---|
Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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