XVF3500-FB167-C Tech Spezifikatioune
XMOS - XVF3500-FB167-C technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu XMOS - XVF3500-FB167-C
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | XMOS | |
Voltage - Versorgung (Vcc / Vdd) | 0.95V ~ 1.05V | |
Supplier Device Package | 167-FBGA (12x7.5) | |
Speed | 500MHz | |
Serie | - | |
RAM Gréisst | 2K x 8 | |
Programm Memory Type | FLASH | |
Programmspeichergréisst | 2MB (2M x 8) | |
Peripheralien | PWM | |
Package / Case | 167-LFBGA | |
Package protegéieren | Tray |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Oszilléierertyp | Internal | |
Operatioun Temperatur | 0°C ~ 70°C (TA) | |
Zuel vun I / O | 59 | |
Mounting Type | Surface Mount | |
EEPROM Gréisst | - | |
Datenkonverter | - | |
Core Size | 32-Bit Single-Core | |
Core Prozessor | XCore | |
Konnektivitéit | Ethernet, SPI, USB | |
Basis Produktnummer | XVF3500 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu XMOS XVF3500-FB167-C.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | XVF3500-FB167-C | AT90S8515-8AC | CY8C6245AZI-S3D42 | STM32L011F3P6TR |
Hiersteller | XMOS | Microchip Technology | Infineon Technologies | STMicroelectronics |
Package protegéieren | Tray | Tray | Tray | Tape & Reel (TR) |
Konnektivitéit | Ethernet, SPI, USB | SPI, UART/USART | FIFO, I²C, IrDA, LINbus, MMC/SD/SDIO, QSPI, SmartCard, SPI, UART/USART, USB | I²C, IrDA, SPI, UART/USART |
Speed | 500MHz | 8MHz | 100MHz, 150MHz | 32MHz |
Peripheralien | PWM | Brown-out Detect/Reset, POR, PWM, WDT | Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT | Brown-out Detect/Reset, DMA, POR, PWM, WDT |
Programm Memory Type | FLASH | FLASH | FLASH | FLASH |
EEPROM Gréisst | - | 512 x 8 | - | 512 x 8 |
RAM Gréisst | 2K x 8 | 512 x 8 | 256 x 8 | 2K x 8 |
Core Size | 32-Bit Single-Core | 8-Bit | 32-Bit Dual-Core | 32-Bit Single-Core |
Serie | - | AVR® 90S | PSoC® 6 | STM32L0 |
Supplier Device Package | 167-FBGA (12x7.5) | 44-TQFP (10x10) | 100-TQFP (14x14) | 20-TSSOP |
Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Core Prozessor | XCore | AVR | ARM® Cortex®-M0+, ARM® Cortex®-M4F | ARM® Cortex®-M0+ |
Zuel vun I / O | 59 | 32 | 64 | 16 |
Voltage - Versorgung (Vcc / Vdd) | 0.95V ~ 1.05V | 4V ~ 6V | 1.7V ~ 3.6V | 1.65V ~ 3.6V |
Datenkonverter | - | - | A/D 16x12b SAR, 10b Sigma-Delta; D/A 2x7/8b | A/D 9x12b |
Oszilléierertyp | Internal | Internal | External, Internal | Internal |
Programmspeichergréisst | 2MB (2M x 8) | 8KB (4K x 16) | 512KB (512K x 8) | 8KB (8K x 8) |
Operatioun Temperatur | 0°C ~ 70°C (TA) | 0°C ~ 70°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
Basis Produktnummer | XVF3500 | AT90S8515 | CY8C6245 | STM32L011 |
Package / Case | 167-LFBGA | 44-TQFP | 100-LQFP | 20-TSSOP (0.173", 4.40mm Width) |
Eroflueden XVF3500-FB167-C PDF DataDhusts an XMOS Dokumentatioun fir XVF3500-FB167-C - XMOS.
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
---|---|
Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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