W25Q32JWZPIQ Tech Spezifikatioune
Winbond Electronics - W25Q32JWZPIQ technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Winbond Electronics - W25Q32JWZPIQ
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | Winbond Electronics Corporation | |
| Schreiwe Cycle Time - Word, Page | 5ms | |
| Voltage - Supply | 1.7V ~ 1.95V | |
| Technologie | FLASH - NOR | |
| Supplier Device Package | 8-WSON (6x5) | |
| Serie | SpiFlash® | |
| Package / Case | 8-WDFN Exposed Pad | |
| Package protegéieren | Tube | |
| Operatioun Temperatur | -40°C ~ 85°C (TA) |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Mounting Type | Surface Mount | |
| Gedächtnis Type | Non-Volatile | |
| Späichergréisst | 32Mbit | |
| Erënnerungsorganisatioun | 4M x 8 | |
| Memory Interface | SPI - Quad I/O | |
| Memory Format | FLASH | |
| Clock Frequency | 133 MHz | |
| Basis Produktnummer | W25Q32 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Winbond Electronics W25Q32JWZPIQ.
| Produktiounsattriff |  |
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|---|---|---|---|---|
| Part Number | W25Q32JWZPIQ | W25Q40BWSVIG | W25Q32JVZPIM | W25Q32JWZPIM |
| Hiersteller | Winbond Electronics | Winbond Electronics | Winbond Electronics | Winbond Electronics |
| Package / Case | 8-WDFN Exposed Pad | 8-SOIC (0.154", 3.90mm Width) | 8-WDFN Exposed Pad | 8-WDFN Exposed Pad |
| Basis Produktnummer | W25Q32 | W25Q40 | W25Q32 | W25Q32 |
| Serie | SpiFlash® | SpiFlash® | SpiFlash® | SpiFlash® |
| Memory Interface | SPI - Quad I/O | SPI - Quad I/O | SPI - Quad I/O, QPI, DTR | SPI - Quad I/O, QPI, DTR |
| Gedächtnis Type | Non-Volatile | Non-Volatile | Non-Volatile | Non-Volatile |
| Späichergréisst | 32Mbit | 4Mbit | 32Mbit | 32Mbit |
| Package protegéieren | Tube | Tube | Tray | Tray |
| Technologie | FLASH - NOR | FLASH - NOR | FLASH - NOR | FLASH - NOR |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Schreiwe Cycle Time - Word, Page | 5ms | 800µs | 3ms | 5ms |
| Memory Format | FLASH | FLASH | FLASH | FLASH |
| Erënnerungsorganisatioun | 4M x 8 | 512K x 8 | 4M x 8 | 4M x 8 |
| Supplier Device Package | 8-WSON (6x5) | 8-VSOP | 8-WSON (6x5) | 8-WSON (6x5) |
| Voltage - Supply | 1.7V ~ 1.95V | 1.65V ~ 1.95V | 2.7V ~ 3.6V | 1.7V ~ 1.95V |
| Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Clock Frequency | 133 MHz | 80 MHz | 133 MHz | 133 MHz |
Eroflueden W25Q32JWZPIQ PDF DataDhusts an Winbond Electronics Dokumentatioun fir W25Q32JWZPIQ - Winbond Electronics.
W25Q40BWSVIGWinbond ElectronicsIC FLASH 4MBIT SPI/QUAD 8VSOP
W25Q40BWSNAGWinbond Electronics CorporationW25Q32JVZPIMWinbond ElectronicsIC FLASH 32MBIT SPI/QUAD 8WSONW25Q40BVNIGWinbond Electronics CorporationW25Q40BWSNBGWinbond Electronics CorporationW25Q32JWUUIQWinbond Electronics CorporationW25Q32JWZPIMWinbond ElectronicsIC FLASH 32MBIT SPI/QUAD 8WSONW25Q32JVZPIQ-TWinbond Electronics CorporationW25Q32JWSSIQWinbond ElectronicsIC FLASH 32MBIT SPI/QUAD 8SOICW25Q32JVZPIQWinbond ElectronicsIC FLASH 32MBIT SPI/QUAD 8WSONW25Q32JWSSIMWINBOND
W25Q32JWSNIQWinbond ElectronicsIC FLASH 32MBIT SPI/QUAD 8SOICW25Q40BWSNJGWinbond Electronics CorporationW25Q40BWNS07Winbond Electronics CorporationW25Q40BWUXIEWinbond Electronics CorporationW25Q32JWBYIQWinbond Electronics CorporationW25Q40BWSNIGWinbond ElectronicsIC FLASH 4MBIT SPI/QUAD 8SOICW25Q40BVSNIGWinbond Electronics Corporation| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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