W25Q256JVFIQ Tech Spezifikatioune
Winbond Electronics - W25Q256JVFIQ technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Winbond Electronics - W25Q256JVFIQ
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | Winbond Electronics Corporation | |
| Schreiwe Cycle Time - Word, Page | 3ms | |
| Voltage - Supply | 2.7V ~ 3.6V | |
| Technologie | FLASH - NOR | |
| Supplier Device Package | 16-SOIC | |
| Serie | SpiFlash® | |
| Package / Case | 16-SOIC (0.295', 7.50mm Width) | |
| Package protegéieren | Tray | |
| Operatioun Temperatur | -40°C ~ 85°C (TA) |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Mounting Type | Surface Mount | |
| Gedächtnis Type | Non-Volatile | |
| Späichergréisst | 256Mbit | |
| Erënnerungsorganisatioun | 32M x 8 | |
| Memory Interface | SPI - Quad I/O | |
| Memory Format | FLASH | |
| Clock Frequency | 133 MHz | |
| Basis Produktnummer | W25Q256 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Winbond Electronics W25Q256JVFIQ.
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|---|---|---|---|---|
| Part Number | W25Q256JVFIQ | W25Q256JWPIQ | W25Q256JVFJM | W25Q256JWFIQ |
| Hiersteller | Winbond Electronics | Winbond Electronics | Winbond Electronics | Winbond Electronics |
| Erënnerungsorganisatioun | 32M x 8 | 32M x 8 | 32M x 8 | 32M x 8 |
| Späichergréisst | 256Mbit | 256Mbit | 256Mbit | 256Mbit |
| Technologie | FLASH - NOR | FLASH - NOR | FLASH - NOR | FLASH - NOR |
| Schreiwe Cycle Time - Word, Page | 3ms | 5ms | 3ms | 5ms |
| Voltage - Supply | 2.7V ~ 3.6V | 1.7V ~ 1.95V | 2.7V ~ 3.6V | 1.7V ~ 1.95V |
| Memory Format | FLASH | FLASH | FLASH | FLASH |
| Basis Produktnummer | W25Q256 | W25Q256 | W25Q256 | W25Q256 |
| Gedächtnis Type | Non-Volatile | Non-Volatile | Non-Volatile | Non-Volatile |
| Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 85°C (TA) |
| Memory Interface | SPI - Quad I/O | SPI - Quad I/O | SPI - Quad I/O | SPI - Quad I/O |
| Clock Frequency | 133 MHz | 133 MHz | 133 MHz | 133 MHz |
| Supplier Device Package | 16-SOIC | 8-WSON (6x5) | 16-SOIC | 16-SOIC |
| Package protegéieren | Tray | Tray | Tube | Tray |
| Serie | SpiFlash® | SpiFlash® | SpiFlash® | SpiFlash® |
| Package / Case | 16-SOIC (0.295', 7.50mm Width) | 8-WDFN Exposed Pad | 16-SOIC (0.295", 7.50mm Width) | 16-SOIC (0.295", 7.50mm Width) |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Eroflueden W25Q256JVFIQ PDF DataDhusts an Winbond Electronics Dokumentatioun fir W25Q256JVFIQ - Winbond Electronics.
W25Q256JVEIQTWinbond Electronics CorporationW25Q256JWPIQWinbond ElectronicsIC FLASH 256MBIT SPI/QUAD 8WSONW25Q256JVFJMWinbond ElectronicsIC FLASH 256MBIT SPI/QUAD 16SOICW25Q256JWPIMWINBONDW25Q256JVMIMWINBONDW25Q256JVFAMWinbond Electronics CorporationW25Q256JWFIQWinbond ElectronicsIC FLASH 256MBIT SPI/QUAD 16SOICW25Q256JVFIQTWinbond Electronics CorporationW25Q256JVEQWINBOND
W25Q256JVEJMWinbond ElectronicsIC FLASH 256MBIT SPI/QUAD 8WSONW25Q256JWBIQWINBONDW25Q256JVESQWinbond Electronics CorporationW25Q256JVFIMWinbond ElectronicsIC FLASH 256MBIT SPI/QUAD 16SOICW25Q256JVFQWinbond Electronics CorporationW25Q256JVEJQWINBOND
W25Q256JWEIQWinbond ElectronicsIC FLASH 256MBIT SPI/QUAD 8WSONW25Q256JVEIQWinbond ElectronicsIC FLASH 256MBIT SPI/QUAD 8WSONW25Q256JVEIQTRWINBOND| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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