W25Q16BVZPIG Tech Spezifikatioune
Winbond Electronics - W25Q16BVZPIG technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Winbond Electronics - W25Q16BVZPIG
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | Winbond Electronics Corporation | |
| Schreiwe Cycle Time - Word, Page | 50µs, 3ms | |
| Voltage - Supply | 2.7V ~ 3.6V | |
| Technologie | FLASH - NOR | |
| Supplier Device Package | 8-WSON (6x5) | |
| Serie | SpiFlash® | |
| Package / Case | 8-WDFN Exposed Pad | |
| Package protegéieren | Tube | |
| Operatioun Temperatur | -40°C ~ 85°C (TA) |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Mounting Type | Surface Mount | |
| Gedächtnis Type | Non-Volatile | |
| Späichergréisst | 16Mbit | |
| Erënnerungsorganisatioun | 2M x 8 | |
| Memory Interface | SPI - Quad I/O | |
| Memory Format | FLASH | |
| Clock Frequency | 104 MHz | |
| Basis Produktnummer | W25Q16 |
| ATTRESSIOUN | BESCHREIWUNG |
|---|---|
| RoHs Status | |
| Fiichtegkeet Sensibilitéitsniveau (MSL) | 3 (168 Hours) |
| Erreecht Status | REACH Unaffected |
| ECCN | EAR99 |
| HTSUS | 8542.32.0071 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Winbond Electronics W25Q16BVZPIG.
| Produktiounsattriff |  |
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|---|---|---|---|---|
| Part Number | W25Q16BVZPIG | W25Q16BVSFIG | W25Q16CLSSIG | W25Q16CLZPIG |
| Hiersteller | Winbond Electronics | Winbond Electronics | Winbond Electronics | Winbond Electronics |
| Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Clock Frequency | 104 MHz | 104 MHz | 50 MHz | 50 MHz |
| Supplier Device Package | 8-WSON (6x5) | 16-SOIC | 8-SOIC | 8-WSON (6x5) |
| Gedächtnis Type | Non-Volatile | Non-Volatile | Non-Volatile | Non-Volatile |
| Basis Produktnummer | W25Q16 | W25Q16 | W25Q16 | W25Q16 |
| Erënnerungsorganisatioun | 2M x 8 | 2M x 8 | 2M x 8 | 2M x 8 |
| Memory Format | FLASH | FLASH | FLASH | FLASH |
| Technologie | FLASH - NOR | FLASH - NOR | FLASH - NOR | FLASH - NOR |
| Package / Case | 8-WDFN Exposed Pad | 16-SOIC (0.295", 7.50mm Width) | 8-SOIC (0.209', 5.30mm Width) | 8-WDFN Exposed Pad |
| Package protegéieren | Tube | Tube | Tube | Tube |
| Serie | SpiFlash® | SpiFlash® | SpiFlash® | SpiFlash® |
| Voltage - Supply | 2.7V ~ 3.6V | 2.7V ~ 3.6V | 2.3V ~ 3.6V | 2.3V ~ 3.6V |
| Memory Interface | SPI - Quad I/O | SPI - Quad I/O | SPI - Quad I/O | SPI - Quad I/O |
| Späichergréisst | 16Mbit | 16Mbit | 16Mbit | 16Mbit |
| Schreiwe Cycle Time - Word, Page | 50µs, 3ms | 50µs, 3ms | 50µs, 3ms | 50µs, 3ms |
Eroflueden W25Q16BVZPIG PDF DataDhusts an Winbond Electronics Dokumentatioun fir W25Q16BVZPIG - Winbond Electronics.
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W25Q16BSIGGDW25Q16CLNIGWinbond Electronics CorporationW25Q16BVSSIGWinbond ElectronicsIC FLASH 16MBIT SPI/QUAD 8SOICW25Q128JWYIQWinbond Electronics CorporationW25Q16CVSIGWinbond Electronics Corporation| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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