THCV217 Tech Spezifikatioune
THine Solutions, Inc. - THCV217 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu THine Solutions, Inc. - THCV217
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | THine Solutions | |
| Voltage - Supply | 1.8V, 3.3V | |
| Supplier Device Package | 105-TFBGA (10x10) | |
| Serie | THine® | |
| Package / Case | 105-TFBGA | |
| Package protegéieren | Tray | |
| Ausgängegkeet | V-by-One®HS |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Operatioun Temperatur | - | |
| Unzuel vun Ausgänge | 2 | |
| Zuel vun Inputs | 42 | |
| Mounting Type | Surface Mount | |
| Input Type | CMOS/TTL | |
| Funktioun | Serializer | |
| Data Rate | 3.4Gbps |
| ATTRESSIOUN | BESCHREIWUNG |
|---|---|
| RoHs Status | |
| Fiichtegkeet Sensibilitéitsniveau (MSL) | 3 (168 Hours) |
| Erreecht Status | REACH Unaffected |
| ECCN | EAR99 |
| HTSUS | 8542.39.0001 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu THine Solutions, Inc. THCV217.
| Produktiounsattriff |  |
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 |
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|---|---|---|---|---|
| Part Number | THCV217 | THCV219 | THCV216 | THCV226 |
| Hiersteller | THine Solutions, Inc. | THine Solutions, Inc. | THine Solutions, Inc. | THine Solutions, Inc. |
| Input Type | CMOS/TTL | CMOS/TTL | V-by-One®HS | V-by-One®HS |
| Unzuel vun Ausgänge | 2 | 1 | 42 | 24 |
| Voltage - Supply | 1.8V, 3.3V | 2.3V ~ 3.6V | 1.8V, 3.3V | 1.62V ~ 1.98V |
| Serie | THine® | - | THine® | V-by-One® HS |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Zuel vun Inputs | 42 | 35 | 2 | 4 |
| Operatioun Temperatur | - | -40°C ~ 85°C | 0°C ~ 70°C (TA) | -40°C ~ 85°C (TA) |
| Package / Case | 105-TFBGA | 64-VFQFN Exposed Pad | 64-TFSOP (0.240", 6.10mm Width) | 128-TQFP |
| Package protegéieren | Tray | Tray | Tray | Tray |
| Funktioun | Serializer | Serializer | Deserializer | Deserializer |
| Ausgängegkeet | V-by-One®HS | V-by-One®HS | LVDS | LVDS |
| Data Rate | 3.4Gbps | 3Gbps | 3.75Gbps | 3.4Gbps |
| Supplier Device Package | 105-TFBGA (10x10) | 64-QFN (9x9) | 64-TSSOP | 128-TQFP (14x14) |
Eroflueden THCV217 PDF DataDhusts an THine Solutions, Inc. Dokumentatioun fir THCV217 - THine Solutions, Inc..
THCV218-1BTATHine SolutionsTHCV219THine Solutions, Inc.1LANE LVCMOS_V-BY-ONEHS 64QFNTHCV217-1BTATHine SolutionsTHCV214-1NTHTHine SolutionsTHCV216-1STNTHine SolutionsTHCV213-9TTATHine SolutionsTHCV226 TQFP128THine SolutionsTHCV220-ONTATHine SolutionsTHCV216THine Solutions, Inc.IC DESERIALIZER DUAL 64TSSOPTHCV226THine Solutions, Inc.4LANE V-BY-ONEHS_LVDS 128TQFPTHCV215THine Solutions, Inc.IC SERIALIZER DUAL 64TSSOPTHCV215-ASTBTHine SolutionsTHCV214-5TTNTHine Solutions
THCV231THine Solutions, Inc.1LANE LVCMOS_V-BY-ONEHS 32QFNTHCV214-1TTNTHine Solutions
THCV214THine Solutions, Inc.IC DESERIALIZER LVDS 48TQFP
THCV218THine Solutions, Inc.IC DESERIALIZER DUAL 145TFBGA
THCV220THine Solutions, Inc.1LANE V-BY-ONEHS_LVCMOS 64QFN| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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