READ2302GSP#GC3 Tech Spezifikatioune
Renesas Electronics America Inc - READ2302GSP#GC3 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Renesas Electronics America Inc - READ2302GSP#GC3
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | Renesas Electronics Corporation | |
Spannung - Versuergungspann (min) | 2.5 V | |
Spannung - Versuergungspann (Max) | 5.5 V | |
Voltage - Input Offset | 6 mV | |
Supplier Device Package | 8-TSSOP | |
Slew Rate | 8V/µs | |
Serie | - | |
Package / Case | 8-TSSOP (0.173", 4.40mm Width) | |
Package protegéieren | Tape & Reel (TR) |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Ausgängegkeet | - | |
Operatioun Temperatur | -40°C ~ 105°C (TA) | |
Zuel vu Circuits | 2 | |
Mounting Type | Surface Mount | |
Band Bandbreed Produkt | 6 MHz | |
Aktuell - Versioun | 750µA | |
Aktuell - Input Bias | 1 pA | |
Basis Produktnummer | READ2302 | |
Verstäerkungstyp | CMOS |
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Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | READ2302GSP#GC3 | OPA2277AIDRMT | LM324N | CA0358E |
Hiersteller | Renesas Electronics America Inc | Texas Instruments | Intersil | Intersil |
Serie | - | - | LinCMOS™ | - |
Operatioun Temperatur | -40°C ~ 105°C (TA) | -40°C ~ 85°C | 0°C ~ 70°C (TJ) | 0°C ~ 70°C |
Band Bandbreed Produkt | 6 MHz | 1 MHz | - | 1 MHz |
Mounting Type | Surface Mount | Surface Mount | Through Hole | Through Hole |
Ausgängegkeet | - | - | - | - |
Verstäerkungstyp | CMOS | General Purpose | General Purpose | General Purpose |
Aktuell - Versioun | 750µA | - | 1.5mA | 1.5mA (x2 Channels) |
Aktuell - Input Bias | 1 pA | 4 nA | 45 nA | 45 nA |
Zuel vu Circuits | 2 | 2 | 4 | 2 |
Basis Produktnummer | READ2302 | OPA2277 | - | - |
Voltage - Input Offset | 6 mV | 35 µV | 2 mV | 2 mV |
Spannung - Versuergungspann (min) | 2.5 V | 4 V | 3 V | 32 V |
Spannung - Versuergungspann (Max) | 5.5 V | 36 V | 32 V | 32 V |
Package protegéieren | Tape & Reel (TR) | Tape & Reel (TR) | Tube | Bulk |
Slew Rate | 8V/µs | 0.8V/µs | - | - |
Supplier Device Package | 8-TSSOP | 8-VSON (4x4) | 14-PDIP | 8-PDIP |
Package / Case | 8-TSSOP (0.173", 4.40mm Width) | 8-VDFN Exposed Pad | 14-DIP (0.300", 7.62mm) | 8-DIP (0.300", 7.62mm) |
Eroflueden READ2302GSP#GC3 PDF DataDhusts an Renesas Electronics America Inc Dokumentatioun fir READ2302GSP#GC3 - Renesas Electronics America Inc.
Allgemeng Länner Login logistesch Zäit Referenz | ||
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Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
---|---|
Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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