HD6417750RF200DV Tech Spezifikatioune
Renesas Electronics America Inc - HD6417750RF200DV technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Renesas Electronics America Inc - HD6417750RF200DV
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | Renesas Electronics Corporation | |
Voltage - Versorgung (Vcc / Vdd) | 1.35V ~ 1.6V | |
Supplier Device Package | 208-HQFP (28x28) | |
Speed | 200MHz | |
Serie | SuperH® SH7750 | |
RAM Gréisst | 48K x 8 | |
Programm Memory Type | ROMless | |
Programmspeichergréisst | - | |
Peripheralien | DMA, POR, WDT | |
Package / Case | 208-BFQFP Exposed Pad | |
Package protegéieren | Tray |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Oszilléierertyp | External | |
Operatioun Temperatur | -40°C ~ 85°C (TA) | |
Zuel vun I / O | 28 | |
Mounting Type | Surface Mount | |
EEPROM Gréisst | - | |
Datenkonverter | - | |
Core Size | 32-Bit Single-Core | |
Core Prozessor | SH-4 | |
Konnektivitéit | EBI/EMI, FIFO, SCI, SmartCard | |
Basis Produktnummer | HD6417750 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Renesas Electronics America Inc HD6417750RF200DV.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | HD6417750RF200DV | HD6417750RBP200V | HD6417750RF240V | HD6417750RF200V |
Hiersteller | Renesas Electronics America Inc | Renesas Electronics America Inc | Renesas Electronics America Inc | Renesas Electronics America Inc |
Voltage - Versorgung (Vcc / Vdd) | 1.35V ~ 1.6V | 1.35V ~ 1.6V | 1.4V ~ 1.6V | 1.35V ~ 1.6V |
Oszilléierertyp | External | External | External | External |
RAM Gréisst | 48K x 8 | 48K x 8 | 48K x 8 | 48K x 8 |
Package protegéieren | Tray | Bulk | Tray | Tray |
Serie | SuperH® SH7750 | SuperH® SH7750 | SuperH® SH7750 | SuperH® SH7750 |
Programmspeichergréisst | - | - | - | - |
Core Size | 32-Bit Single-Core | 32-Bit Single-Core | 32-Bit Single-Core | 32-Bit Single-Core |
EEPROM Gréisst | - | - | - | - |
Peripheralien | DMA, POR, WDT | DMA, POR, WDT | DMA, POR, WDT | DMA, POR, WDT |
Supplier Device Package | 208-HQFP (28x28) | 256-BGA (27x27) | 208-HQFP (28x28) | 208-HQFP (28x28) |
Programm Memory Type | ROMless | ROMless | ROMless | ROMless |
Zuel vun I / O | 28 | 28 | 28 | 28 |
Package / Case | 208-BFQFP Exposed Pad | 256-BBGA | 208-BFQFP Exposed Pad | 208-BFQFP Exposed Pad |
Speed | 200MHz | 200MHz | 240MHz | 200MHz |
Datenkonverter | - | - | - | - |
Konnektivitéit | EBI/EMI, FIFO, SCI, SmartCard | EBI/EMI, FIFO, SCI, SmartCard | EBI/EMI, FIFO, SCI, SmartCard | EBI/EMI, FIFO, SCI, SmartCard |
Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Basis Produktnummer | HD6417750 | HD6417750 | HD6417750 | HD6417750 |
Core Prozessor | SH-4 | SH-4 | SH-4 | SH-4 |
Operatioun Temperatur | -40°C ~ 85°C (TA) | -20°C ~ 75°C (TA) | -20°C ~ 75°C (TA) | -20°C ~ 75°C (TA) |
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
---|---|
Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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