HD6417713FV Tech Spezifikatioune
Renesas Electronics America Inc - HD6417713FV technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Renesas Electronics America Inc - HD6417713FV
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | Renesas Electronics Corporation | |
| Voltage - Versorgung (Vcc / Vdd) | 1.4V ~ 1.6V | |
| Supplier Device Package | 256-HQFP (28x28) | |
| Speed | 200MHz | |
| Serie | SuperH® SH7700 | |
| RAM Gréisst | 16K x 8 | |
| Programm Memory Type | ROMless | |
| Programmspeichergréisst | - | |
| Peripheralien | DMA, POR, WDT | |
| Package / Case | 256-BFQFP Exposed Pad | |
| Package protegéieren | Tray |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Oszilléierertyp | External | |
| Operatioun Temperatur | -20°C ~ 75°C | |
| Zuel vun I / O | 24 | |
| Mounting Type | Surface Mount | |
| EEPROM Gréisst | - | |
| Datenkonverter | - | |
| Core Size | 32-Bit Single-Core | |
| Core Prozessor | SH-3 DSP | |
| Konnektivitéit | EBI/EMI, Ethernet, FIFO, SCI, SIO | |
| Basis Produktnummer | HD6417713 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Renesas Electronics America Inc HD6417713FV.
| Produktiounsattriff |  |
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|
 |
|---|---|---|---|---|
| Part Number | HD6417713FV | HD6417727BP160CV | HD6417713XV | HD6417709SF133BV |
| Hiersteller | Renesas Electronics America Inc | Renesas Electronics America Inc | Renesas Electronics America Inc | Renesas Electronics Corporation |
| RAM Gréisst | 16K x 8 | 32K x 8 | 16K x 8 | - |
| Package protegéieren | Tray | Tray | Tray | - |
| Serie | SuperH® SH7700 | SuperH® SH7700 | SuperH® SH Ethernet | - |
| Programmspeichergréisst | - | - | - | - |
| Basis Produktnummer | HD6417713 | HD6417727 | HD6417713 | - |
| Mounting Type | Surface Mount | Surface Mount | - | - |
| Peripheralien | DMA, POR, WDT | DMA, LCD, POR, WDT | DMA, POR, WDT | - |
| Voltage - Versorgung (Vcc / Vdd) | 1.4V ~ 1.6V | 1.7V ~ 2.05V | 1.4V ~ 1.6V | - |
| Oszilléierertyp | External | Internal | External | - |
| EEPROM Gréisst | - | - | - | - |
| Core Prozessor | SH-3 DSP | SH-3 DSP | SH-3 DSP | - |
| Datenkonverter | - | A/D 6x10b; D/A 2x8b | - | - |
| Zuel vun I / O | 24 | 104 | 24 | - |
| Supplier Device Package | 256-HQFP (28x28) | 240-LFBGA (13x13) | - | - |
| Package / Case | 256-BFQFP Exposed Pad | 240-LFBGA | - | - |
| Programm Memory Type | ROMless | ROMless | ROMless | - |
| Konnektivitéit | EBI/EMI, Ethernet, FIFO, SCI, SIO | FIFO, SCI, SIO, SmartCard, USB | EBI/EMI, Ethernet, FIFO, SCI, SIO | - |
| Operatioun Temperatur | -20°C ~ 75°C | -20°C ~ 75°C (TA) | -20°C ~ 75°C (TA) | - |
| Core Size | 32-Bit Single-Core | 32-Bit Single-Core | 32-Bit Single-Core | - |
| Speed | 200MHz | 160MHz | 200MHz | - |
HD6417709SF133BVRenesas Electronics Corporation
HD6417709SSH-133HITACHIHD6417720BPRenesasHD6417712BPVRenesasHD6417710FVRenesas Electronics CorporationHD6417709SHF200BVRenesas Electronics CorporationHD6417720BP133CVRenesasHD6417727BP160CVRenesas Electronics America IncIC MCU 32BIT ROMLESS 240LFBGAHD6417727F160CRenesasHD6417709SF167BVRenesas Electronics CorporationHD6417709SHX200BVRenesasHD6417710BPVRenesas Electronics CorporationHD6417727BP160CRenesas Electronics CorporationHD6417727F100CVRenesasHD6417727F160HITACHIHD6417712FVRenesas Electronics CorporationHD6417727F100BRenesas Electronics CorporationHD6417713XVRenesas Electronics America IncIC MCU 32BIT ROMLESS 256HQFP| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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