DF2166VT33V Tech Spezifikatioune
Renesas Electronics America Inc - DF2166VT33V technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Renesas Electronics America Inc - DF2166VT33V
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | Renesas Electronics Corporation | |
Voltage - Versorgung (Vcc / Vdd) | 3V ~ 3.6V | |
Supplier Device Package | 144-TQFP (16x16) | |
Speed | 33MHz | |
Serie | H8® H8S/2100 | |
RAM Gréisst | 40K x 8 | |
Programm Memory Type | FLASH | |
Programmspeichergréisst | 512KB (512K x 8) | |
Peripheralien | POR, PWM, WDT | |
Package / Case | 144-TQFP | |
Package protegéieren | Tray |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Oszilléierertyp | External | |
Operatioun Temperatur | -20°C ~ 75°C (TA) | |
Zuel vun I / O | 106 | |
Mounting Type | Surface Mount | |
EEPROM Gréisst | - | |
Datenkonverter | A/D 8x10b; D/A 2x8b | |
Core Size | 16-Bit | |
Core Prozessor | H8S/2000 | |
Konnektivitéit | I²C, IrDA, LPC, SCI, SmartCard | |
Basis Produktnummer | DF2166 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Renesas Electronics America Inc DF2166VT33V.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | DF2166VT33V | DF2144FA20V | DF2140BVTE10V | DF2145BVFA10V |
Hiersteller | Renesas Electronics America Inc | Renesas Electronics America Inc | Renesas Electronics America Inc | Renesas Electronics America Inc |
Core Prozessor | H8S/2000 | H8S/2000 | H8S/2000 | H8S/2000 |
Speed | 33MHz | 20MHz | 10MHz | 10MHz |
Voltage - Versorgung (Vcc / Vdd) | 3V ~ 3.6V | 4V ~ 5.5V | 2.7V ~ 3.6V | 2.7V ~ 3.6V |
Package / Case | 144-TQFP | 100-BFQFP | 100-TQFP | 100-BFQFP |
Programmspeichergréisst | 512KB (512K x 8) | 128KB (128K x 8) | 64KB (64K x 8) | 256KB (256K x 8) |
Peripheralien | POR, PWM, WDT | POR, PWM, WDT | PWM, WDT | PWM, WDT |
Konnektivitéit | I²C, IrDA, LPC, SCI, SmartCard | IrDA, SCI | Host Interface (LPC), I²C, IrDA, SCI, X-Bus | Host Interface (LPC), I²C, IrDA, SCI, X-Bus |
EEPROM Gréisst | - | - | - | - |
Supplier Device Package | 144-TQFP (16x16) | 100-QFP (14x14) | 100-TQFP (14x14) | 100-QFP (14x14) |
Package protegéieren | Tray | Tray | Tray | Tray |
Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Operatioun Temperatur | -20°C ~ 75°C (TA) | -20°C ~ 75°C (TA) | -20°C ~ 75°C (TA) | -20°C ~ 75°C (TA) |
Zuel vun I / O | 106 | 74 | 74 | 74 |
Datenkonverter | A/D 8x10b; D/A 2x8b | A/D 8x10b; D/A 2x8b | A/D 8x10b; D/A 2x8b | A/D 8x10b; D/A 2x8b |
Basis Produktnummer | DF2166 | DF2144 | DF2140 | DF2145 |
RAM Gréisst | 40K x 8 | 4K x 8 | 4K x 8 | 8K x 8 |
Oszilléierertyp | External | Internal | Internal | Internal |
Programm Memory Type | FLASH | FLASH | FLASH | FLASH |
Core Size | 16-Bit | 16-Bit | 16-Bit | 16-Bit |
Serie | H8® H8S/2100 | H8® H8S/2100 | H8® H8S/2100 | H8® H8S/2100 |
Eroflueden DF2166VT33V PDF DataDhusts an Renesas Electronics America Inc Dokumentatioun fir DF2166VT33V - Renesas Electronics America Inc.
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
---|---|
Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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