UES1E330MPM Tech Spezifikatioune
Nichicon - UES1E330MPM technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Nichicon - UES1E330MPM
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | Nichicon | |
| Voltage - bewäert | 25 V | |
| Toleranz | ±20% | |
| Surface Mount Land Gréisst | - | |
| Gréisst / Dimensioun | 0.315' Dia (8.00mm) | |
| Serie | UES | |
| Bewäertungen | - | |
| Polarisatioun | Bi-Polar | |
| Package / Case | Radial, Can |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Package protegéieren | Bulk | |
| Operatioun Temperatur | -40°C ~ 85°C | |
| Mounting Type | Through Hole | |
| Lifetime @ Temp. | 1000 Hrs @ 85°C | |
| Lead Abstand | 0.138' (3.50mm) | |
| Héicht - Sëtz (Max) | 0.512' (13.00mm) | |
| ESR (equivalent Serie Resistance) | - | |
| Kapazitéit | 33 µF | |
| Applikatiounen | Audio |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Nichicon UES1E330MPM.
| Produktiounsattriff |  |
 |
 |
 |
|---|---|---|---|---|
| Part Number | UES1E330MPM | UES701HR2 | UES1306 | UES2603 |
| Hiersteller | Nichicon | MSC | Microchip Technology | Microchip Technology |
| ESR (equivalent Serie Resistance) | - | - | - | - |
| Toleranz | ±20% | - | - | - |
| Bewäertungen | - | - | - | - |
| Package protegéieren | Bulk | - | Bulk | Bulk |
| Polarisatioun | Bi-Polar | - | - | - |
| Gréisst / Dimensioun | 0.315' Dia (8.00mm) | - | - | - |
| Lifetime @ Temp. | 1000 Hrs @ 85°C | - | - | - |
| Lead Abstand | 0.138' (3.50mm) | - | - | - |
| Héicht - Sëtz (Max) | 0.512' (13.00mm) | - | - | - |
| Mounting Type | Through Hole | - | Through Hole | Through Hole |
| Applikatiounen | Audio | - | - | - |
| Operatioun Temperatur | -40°C ~ 85°C | - | - | - |
| Voltage - bewäert | 25 V | - | - | - |
| Surface Mount Land Gréisst | - | - | - | - |
| Package / Case | Radial, Can | - | B, Axial | TO-204AA, TO-3 |
| Serie | UES | - | - | - |
| Kapazitéit | 33 µF | - | - | - |
Eroflueden UES1E330MPM PDF DataDhusts an Nichicon Dokumentatioun fir UES1E330MPM - Nichicon.
UES701HR2MSCIGBT ModuleUES1306Microchip TechnologyDIODE GEN PURP 400V 3A AXIALUES2603Microchip TechnologyDIODE GEN PURP 150V 30A TO204ADUES502MSCIGBT ModuleUES504RMSCIGBT ModuleUES702Microchip TechnologyDIODE GEN PURP 100V 25A DO4UES1306Solid State Inc.DIODE GEN PURP 400V 3A AXIALUES702RMicrochip TechnologyDIODE GEN PURP 100V 25A DO203AAUES502RMSCIGBT ModuleUES08A05L04BRIGHTKINUES701Microchip TechnologyDIODE GEN PURP 50V 25A DO203AAUES501RMSCIGBT ModuleUES703Microchip TechnologyDIODE GEN PURP 50V 25A DO203AAUES501MSCIGBT ModuleUES503MSCIGBT ModuleUES504MSCIGBT ModuleUES702HR2MSCIGBT ModuleUES701RMicrochip TechnologyDIODE GEN PURP 50V 25A DO203AA| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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