APA150-BG456 Tech Spezifikatioune
Microsemi Corporation - APA150-BG456 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Microsemi Corporation - APA150-BG456
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | Microsemi | |
| Voltage - Supply | 2.3V ~ 2.7V | |
| Total RAM Bits | 36864 | |
| Supplier Device Package | 456-PBGA (35x35) | |
| Serie | ProASICPLUS | |
| Package / Case | 456-BBGA |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Package protegéieren | Tray | |
| Operatioun Temperatur | 0°C ~ 70°C (TA) | |
| Zuel vun I / O | 242 | |
| Zuel vu Gates | 150000 | |
| Mounting Type | Surface Mount | |
| Basis Produktnummer | APA150 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Microsemi Corporation APA150-BG456.
| Produktiounsattriff |  |
 |
|
 |
|---|---|---|---|---|
| Part Number | APA150-BG456 | APA150-FG256 | APA150-BG456I | APA150-FG144I |
| Hiersteller | Microsemi Corporation | Microchip Technology | Microsemi Corporation | Microchip Technology |
| Package protegéieren | Tray | Tray | Tray | Tray |
| Basis Produktnummer | APA150 | APA150 | APA150 | APA150 |
| Voltage - Supply | 2.3V ~ 2.7V | 2.3V ~ 2.7V | 2.3V ~ 2.7V | 2.3V ~ 2.7V |
| Zuel vun I / O | 242 | 186 | 242 | 100 |
| Operatioun Temperatur | 0°C ~ 70°C (TA) | 0°C ~ 70°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Zuel vu Gates | 150000 | 150000 | 150000 | 150000 |
| Supplier Device Package | 456-PBGA (35x35) | 256-FPBGA (17x17) | 456-PBGA (35x35) | 144-FPBGA (13x13) |
| Package / Case | 456-BBGA | 256-LBGA | 456-BBGA | 144-LBGA |
| Total RAM Bits | 36864 | 36864 | 36864 | 36864 |
| Serie | ProASICPLUS | ProASICPLUS | ProASICPLUS | ProASICPLUS |
Eroflueden APA150-BG456 PDF DataDhusts an Microsemi Corporation Dokumentatioun fir APA150-BG456 - Microsemi Corporation.
APA150-FG256IPM61ACTELAPA102APA
APA100-101MArtesyn Embedded PowerAC/DC CONVERTER 383V 1200WAPA150-FG256Microchip TechnologyIC FPGA 186 I/O 256FBGAAPA150-BG456IMicrosemi CorporationIC FPGA 242 I/O 456BGAAPA100-101IGBT ModuleAPA150-FG144IMicrochip TechnologyIC FPGA 100 I/O 144FBGAAPA100-111Artesyn Embedded PowerIGBT ModuleAPA102CAPA
APA1000-PQG208IMicrochip TechnologyIC FPGA 158 I/O 208QFPAPA100-112Artesyn Embedded PowerIGBT ModuleAPA150-FGG144IMicrochip TechnologyIC FPGA 100 I/O 144FBGAAPA150-FG144Microchip TechnologyIC FPGA 100 I/O 144FBGAAPA150-BGG456Microsemi CorporationIC FPGA 242 I/O 456BGA
APA1000-CQ208BMicrochip TechnologyIC FPGA 158 I/O 208CQFPAPA150-FG256IMicrochip TechnologyIC FPGA 186 I/O 256FBGAAPA150-FG256IX95/DIEHLACTELAPA100-103Artesyn Embedded PowerIGBT Module| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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