NAND08GW3C2BN6E Tech Spezifikatioune
Micron Technology Inc. - NAND08GW3C2BN6E technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Micron Technology Inc. - NAND08GW3C2BN6E
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | Micron Technology | |
| Schreiwe Cycle Time - Word, Page | 25ns | |
| Voltage - Supply | 2.7V ~ 3.6V | |
| Technologie | FLASH - NAND | |
| Supplier Device Package | 48-TSOP | |
| Serie | - | |
| Package / Case | 48-TFSOP (0.724', 18.40mm Width) | |
| Package protegéieren | Tray | |
| Operatioun Temperatur | -40°C ~ 85°C (TA) |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Mounting Type | Surface Mount | |
| Gedächtnis Type | Non-Volatile | |
| Späichergréisst | 8Gbit | |
| Erënnerungsorganisatioun | 1G x 8 | |
| Memory Interface | Parallel | |
| Memory Format | FLASH | |
| Basis Produktnummer | NAND08G | |
| Zougangszäit | 25 ns |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Micron Technology Inc. NAND08GW3C2BN6E.
| Produktiounsattriff |  |
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|---|---|---|---|---|
| Part Number | NAND08GW3C2BN6E | NAND128W3A0BN6E | NAND128W3A2BN6E | NAND08GAH0BZA5E |
| Hiersteller | Micron Technology Inc. | Micron Technology Inc. | Micron Technology Inc. | Micron Technology Inc. |
| Zougangszäit | 25 ns | 50 ns | 50 ns | - |
| Gedächtnis Type | Non-Volatile | Non-Volatile | Non-Volatile | Non-Volatile |
| Technologie | FLASH - NAND | FLASH - NAND | FLASH - NAND | FLASH - NAND |
| Memory Format | FLASH | FLASH | FLASH | FLASH |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Package protegéieren | Tray | Tray | Tray | Tray |
| Supplier Device Package | 48-TSOP | 48-TSOP | 48-TSOP | 169-LFBGA (12x16) |
| Package / Case | 48-TFSOP (0.724', 18.40mm Width) | 48-TFSOP (0.724", 18.40mm Width) | 48-TFSOP (0.724', 18.40mm Width) | 169-LFBGA |
| Voltage - Supply | 2.7V ~ 3.6V | 2.7V ~ 3.6V | 2.7V ~ 3.6V | 2.7V ~ 3.6V |
| Schreiwe Cycle Time - Word, Page | 25ns | 50ns | 50ns | - |
| Späichergréisst | 8Gbit | 128Mbit | 128Mbit | 8Gbit |
| Serie | - | - | - | - |
| Basis Produktnummer | NAND08G | NAND128 | NAND128 | NAND08G |
| Erënnerungsorganisatioun | 1G x 8 | 16M x 8 | 16M x 8 | 1G x 8 |
| Memory Interface | Parallel | Parallel | Parallel | MMC |
| Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -25°C ~ 85°C (TA) |
Eroflueden NAND08GW3C2BN6E PDF DataDhusts an Micron Technology Inc. Dokumentatioun fir NAND08GW3C2BN6E - Micron Technology Inc..
NAND08GW3B2AN6STMicroelectronicsNAND128W3A0BN6EMicron Technology Inc.IC FLASH 128MBIT PARALLEL 48TSOPNAND128W3A0BN6FSTMicroelectronicsNAND08GW3B2CN6MSTMicroelectronicsNAND128W3A0BN6STMicroelectronicsNAND08GW3B2CN6STMicroelectronicsNAND128W3A2BN6EMicron Technology Inc.IC FLASH 128MBIT PARALLEL 48TSOPNAND08GW3B2CN6ESTMicroelectronicsNAND08GAH0NZA5STMicroelectronicsNAND08GAHOBZA5ESTMicroelectronicsNAND08GAH0BZA5EMicron Technology Inc.IC FLSH 8GBIT MMC 52MHZ 169LFBGANAND08GW3F2AN6EMicron Technology Inc.IC FLASH 8GBIT PARALLEL 48TSOPNAND08GW3F2AN6STMicroelectronicsNAND04GW3C2BN6EMicron Technology Inc.IC FLASH 4GBIT PARALLEL 48TSOPNAND128W3AABN6STMicroelectronicsNAND08GW382CN6STMicroelectronicsNAND128W3A2BN6FSTMicroelectronicsNAND128W3A2BN6STMicroelectronics| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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