- Jess***Jones
- 2026/04/17
PCN Design / Spezifizéierung
Memory 24-May-2022.pdfMT29F2T08EMLCEJ4-R:C TR Tech Spezifikatioune
Micron Technology Inc. - MT29F2T08EMLCEJ4-R:C TR technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Micron Technology Inc. - MT29F2T08EMLCEJ4-R:C TR
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | Micron Technology | |
| Schreiwe Cycle Time - Word, Page | - | |
| Voltage - Supply | 2.7V ~ 3.6V | |
| Technologie | FLASH - NAND (TLC) | |
| Supplier Device Package | 132-VBGA (12x18) | |
| Serie | - | |
| Package / Case | 132-VBGA | |
| Package protegéieren | Tape & Reel (TR) |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Operatioun Temperatur | 0°C ~ 70°C (TA) | |
| Mounting Type | Surface Mount | |
| Gedächtnis Type | Non-Volatile | |
| Späichergréisst | 2Tbit | |
| Erënnerungsorganisatioun | 256G x 8 | |
| Memory Interface | Parallel | |
| Memory Format | FLASH | |
| Basis Produktnummer | MT29F2T08 |
| ATTRESSIOUN | BESCHREIWUNG |
|---|---|
| Fiichtegkeet Sensibilitéitsniveau (MSL) | 3 (168 Hours) |
| Erreecht Status | REACH Unaffected |
| ECCN | OBSOLETE |
| HTSUS | 8542.32.0071 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Micron Technology Inc. MT29F2T08EMLCEJ4-R:C TR.
| Produktiounsattriff | ![]() |
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|---|---|---|---|---|
| Part Number | MT29F2T08EMLCEJ4-QJ:C TR | MT29F2T08EMLEEJ4-QA:E TR | MT29F2T08EMLEEJ4-QD:E TR | MT29F2T08EMLCEJ4-R:C |
| Hiersteller | Micron Technology Inc. | Micron Technology Inc. | Micron Technology Inc. | Micron Technology Inc. |
| Operatioun Temperatur | - | -40°C ~ 85°C | 0°C ~ 70°C | -40°C ~ 85°C |
| Technologie | - | - | - | - |
| Schreiwe Cycle Time - Word, Page | - | - | - | - |
| Basis Produktnummer | - | DAC34H84 | MAX500 | ADS62P42 |
| Package protegéieren | - | Tape & Reel (TR) | Tube | Tape & Reel (TR) |
| Memory Format | - | - | - | - |
| Gedächtnis Type | - | - | - | - |
| Erënnerungsorganisatioun | - | - | - | - |
| Mounting Type | - | Surface Mount | Through Hole | Surface Mount |
| Supplier Device Package | - | 196-NFBGA (12x12) | 16-PDIP | 64-VQFN (9x9) |
| Späichergréisst | - | - | - | - |
| Voltage - Supply | - | - | - | - |
| Serie | - | - | - | - |
| Package / Case | - | 196-LFBGA | 16-DIP (0.300', 7.62mm) | 64-VFQFN Exposed Pad |
| Memory Interface | - | - | - | - |
Eroflueden MT29F2T08EMLCEJ4-R:C TR PDF DataDhusts an Micron Technology Inc. Dokumentatioun fir MT29F2T08EMLCEJ4-R:C TR - Micron Technology Inc..
MT29F2T08EMLEEJ4-QA:E TRMicron Technology Inc.TLC 2T 256GX8 VBGA QDP
MT29F2T08EMLEEJ4-QD:E TRMicron Technology Inc.TLC 2T 256GX8 VBGA QDP
MT29F2T08EMLEEJ4-QJ:EMicron Technology Inc.TLC 2T 256GX8 VBGA QDP
MT29F2T08EMLEEJ4-QD:EMicron Technology Inc.TLC 2T 256GX8 VBGA QDP
MT29F2T08EMLEEJ4-QC:EMicron Technology Inc.TLC 2T 256GX8 VBGA QDP
MT29F2T08EMLEEJ4-M:E TRMicron Technology Inc.TLC 2T 256GX8 VBGA QDP
MT29F2T08EMLCEJ4-QJ:C TRMicron Technology Inc.TLC 2T 256GX8 VBGA QDP
MT29F2T08EMLEEJ4-QA:EMicron Technology Inc.TLC 2T 256GX8 VBGA QDP
MT29F2T08EMLEEJ4-M:EMicron Technology Inc.TLC 2T 256GX8 VBGA QDP
MT29F2T08EMLEEJ4-QC:E TRMicron Technology Inc.TLC 2T 256GX8 VBGA QDP
MT29F2T08EMLCEJ4-QJ:CMicron Technology Inc.TLC 2T 256GX8 VBGA QDP
MT29F2T08EMHBFJ4-T:BMicronÄr E-Mail Adress gëtt net publizéiert.
| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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