U3761MB-XFNG3G Tech Spezifikatioune
Microchip Technology - U3761MB-XFNG3G technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Microchip Technology - U3761MB-XFNG3G
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | Microchip Technology | |
| Voltage - Supply | - | |
| Supplier Device Package | 44-SSO | |
| Serie | - | |
| Power (Watts) | 900 mW | |
| Package / Case | 44-BSOP (0.295', 7.50mm Width) | |
| Package protegéieren | Tape & Reel (TR) |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Operatioun Temperatur | -25°C ~ 75°C | |
| Zuel vu Circuits | 1 | |
| Mounting Type | Surface Mount | |
| Interface | - | |
| Funktioun | Universal Telephone Circuit | |
| Aktuell - Versioun | 3.8mA | |
| Basis Produktnummer | U3761M |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Microchip Technology U3761MB-XFNG3G.
| Produktiounsattriff |  |
 |
 |
 |
|---|---|---|---|---|
| Part Number | U3761MB-XFNG3G | SI32185-A-GM | HC55185CIMZ | VSC8541XMV-05 |
| Hiersteller | Microchip Technology | Skyworks Solutions Inc. | Renesas Electronics America Inc | Microchip Technology |
| Power (Watts) | 900 mW | - | - | - |
| Package / Case | 44-BSOP (0.295', 7.50mm Width) | 40-VFQFN Exposed Pad | 28-LCC (J-Lead) | 68-VFQFN Exposed Pad |
| Funktioun | Universal Telephone Circuit | - | Subscriber Line Interface Concept (SLIC) | Ethernet |
| Operatioun Temperatur | -25°C ~ 75°C | -40°C ~ 85°C | -40°C ~ 85°C | -40°C ~ 125°C |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Serie | - | ProSLIC® | RSLIC18 | - |
| Zuel vu Circuits | 1 | 1 | 1 | 1 |
| Interface | - | 3-Wire | - | GMII, MII, RMII |
| Package protegéieren | Tape & Reel (TR) | Tray | Bag | Tray |
| Voltage - Supply | - | 3.3V | - | - |
| Basis Produktnummer | U3761M | SI32185 | HC55185 | VSC8541 |
| Supplier Device Package | 44-SSO | 40-QFN (6x6) | 28-PLCC (11.51x11.51) | 68-QFN (8x8) |
| Aktuell - Versioun | 3.8mA | - | - | - |
Eroflueden U3761MB-XFNG3G PDF DataDhusts an Microchip Technology Dokumentatioun fir U3761MB-XFNG3G - Microchip Technology.
SI32185-A-GMSkyworks Solutions Inc.IC TELECOM INTERFACE 40QFN
U3770MMHSHC55185CIMZRenesas Electronics America IncIC SLIC RINGING VOIP 100V 28PLCCVSC8541XMV-05Microchip TechnologyIC TELECOM INTERFACE 68QFNU3761MBTFK
DS2180AAnalog Devices Inc./Maxim IntegratedIC TELECOM INTERFACE 40DIPU3761MB-TTEMIC
VSC8502XML-03Microchip TechnologyIC TELECOM INTERFACE 135QFN
U3741BM-M2FLG3Atmel (Microchip Technology)
PEB2091NV5.3Infineon TechnologiesISDN ECHO-CANCELLATION CIRCUIT-QU3770M-MFPG3TEMICU3760MBTFKU3761MB-XTEMICU3741BM-M3FLG3Atmel (Microchip Technology)U3741BMTEMIC
VSC8491YJU-14Microchip TechnologyIC TELECOM INTERFACE 10G
U3741BM-P3FLG3Microchip TechnologyRF RX ASK/FSK 300-450MHZ 20SOICU3741BM-P2FLG3Microchip TechnologyRF RX ASK/FSK 300-450MHZ 20SOIC| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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