SG2013J Tech Spezifikatioune
Microchip Technology - SG2013J technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Microchip Technology - SG2013J
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | Microchip Technology | |
| Voltage - Collector Emitter Breakdown (Max) | 50V | |
| Vce Saturation (Max) @ Ib, Ic | 1.9V @ 600µA, 500mA | |
| Transistor Type | 7 NPN Darlington | |
| Supplier Device Package | 16-CERDIP | |
| Serie | - | |
| Power - Max | - | |
| Package / Case | 16-CDIP (0.300", 7.62mm) |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Package protegéieren | Tray | |
| Operatioun Temperatur | -55°C ~ 125°C (TA) | |
| Mounting Type | Through Hole | |
| Frequenz - Iwwergang | - | |
| DC Aktuelle Verstärker (hFE) (Min) @ Ic, Vce | 900 @ 500mA, 2V | |
| Aktuell - Kollektorat Cutoff (Max) | - | |
| Aktuell - Sammler (Ic) (Max) | 600mA | |
| Basis Produktnummer | SG2013 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Microchip Technology SG2013J.
| Produktiounsattriff |  |
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|---|---|---|---|---|
| Part Number | SG2013J | SG2023J | SG2024J | SG2011-2.5XK3L |
| Hiersteller | Microchip Technology | Microchip Technology | Microchip Technology | SGMICRO |
| Aktuell - Kollektorat Cutoff (Max) | - | - | - | - |
| Basis Produktnummer | SG2013 | SG2023 | SG2024 | - |
| Supplier Device Package | 16-CERDIP | 16-CERDIP | 16-CERDIP | - |
| Transistor Type | 7 NPN Darlington | 7 NPN Darlington | 7 NPN Darlington | - |
| Aktuell - Sammler (Ic) (Max) | 600mA | 500mA | 500mA | - |
| Power - Max | - | - | - | - |
| DC Aktuelle Verstärker (hFE) (Min) @ Ic, Vce | 900 @ 500mA, 2V | 1000 @ 350mA, 2V | 1000 @ 350mA, 2V | - |
| Voltage - Collector Emitter Breakdown (Max) | 50V | 95V | 95V | - |
| Vce Saturation (Max) @ Ib, Ic | 1.9V @ 600µA, 500mA | 1.6V @ 500µA, 350mA | 1.6V @ 500µA, 350mA | - |
| Mounting Type | Through Hole | Through Hole | Through Hole | - |
| Serie | - | - | - | - |
| Frequenz - Iwwergang | - | - | - | - |
| Package protegéieren | Tray | Tray | Tray | - |
| Package / Case | 16-CDIP (0.300", 7.62mm) | 16-CDIP (0.300", 7.62mm) | 16-CDIP (0.300", 7.62mm) | - |
| Operatioun Temperatur | -55°C ~ 125°C (TA) | -55°C ~ 125°C (TA) | -55°C ~ 125°C (TA) | - |
Eroflueden SG2013J PDF DataDhusts an Microchip Technology Dokumentatioun fir SG2013J - Microchip Technology.
SG2011-2.5XK3LSGMICROSG2011-3.3XK3L/TRSGMSG2011-2.8XN3/TRSGMICROSG2012-3.0XKC3RSGMICROSG2023JMicrochip TechnologyDRIVER - MEDIUM CURRENT ARRAY, HSG2011-3.3XN3/TRSGMSG206FKODENSHISG2013J/883MSCSG2021JMSCSG2011-2.8XK3L/TRSGMICROSG2011-3.3XK3/TRSGMSG2024J/883BMSCSG206SKODENSHISG2011-2.5XK3L/TRSGMICROSG2030S-HSILICONGEARSG2012-3.3XKC3RMO&USG2023J/883BMSCSG2024JMicrochip TechnologyDRIVER - MEDIUM CURRENT ARRAY, H| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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