PIC16LF1713-I/SP Tech Spezifikatioune
Microchip Technology - PIC16LF1713-I/SP technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Microchip Technology - PIC16LF1713-I/SP
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | Microchip Technology | |
Voltage - Versorgung (Vcc / Vdd) | 1.8V ~ 3.6V | |
Supplier Device Package | 28-SPDIP | |
Speed | 32MHz | |
Serie | PIC® XLP™ 16F | |
RAM Gréisst | 512 x 8 | |
Programm Memory Type | FLASH | |
Programmspeichergréisst | 7KB (4K x 14) | |
Peripheralien | Brown-out Detect/Reset, POR, PWM, WDT | |
Package / Case | 28-DIP (0.300", 7.62mm) | |
Package protegéieren | Tube |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Oszilléierertyp | Internal | |
Operatioun Temperatur | -40°C ~ 85°C (TA) | |
Zuel vun I / O | 25 | |
Mounting Type | Through Hole | |
EEPROM Gréisst | - | |
Datenkonverter | A/D 17x10b; D/A 1x5b, 1x8b | |
Core Size | 8-Bit | |
Core Prozessor | PIC | |
Konnektivitéit | I²C, LINbus, SPI, UART/USART | |
Basis Produktnummer | PIC16LF1713 |
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Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | PIC16LF1713-I/SP | PIC16LF1709-I/SS | PIC16LF1708T-I/ML | PIC16LF1709-E/ML |
Hiersteller | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
Basis Produktnummer | PIC16LF1713 | PIC16LF1709 | PIC16LF1708 | PIC16LF1709 |
Package / Case | 28-DIP (0.300", 7.62mm) | 20-SSOP (0.209", 5.30mm Width) | 20-VFQFN Exposed Pad | 20-VFQFN Exposed Pad |
Speed | 32MHz | 32MHz | 32MHz | 32MHz |
Supplier Device Package | 28-SPDIP | 20-SSOP | 20-QFN (4x4) | 20-QFN (4x4) |
Voltage - Versorgung (Vcc / Vdd) | 1.8V ~ 3.6V | 1.8V ~ 3.6V | 1.8V ~ 3.6V | 1.8V ~ 3.6V |
RAM Gréisst | 512 x 8 | 1K x 8 | 512 x 8 | 1K x 8 |
Zuel vun I / O | 25 | 18 | 18 | 18 |
Konnektivitéit | I²C, LINbus, SPI, UART/USART | I²C, LINbus, SPI, UART/USART | I²C, LINbus, SPI, UART/USART | I²C, LINbus, SPI, UART/USART |
Programm Memory Type | FLASH | FLASH | FLASH | FLASH |
Datenkonverter | A/D 17x10b; D/A 1x5b, 1x8b | A/D 12x10b; D/A 1x8b | A/D 12x10b; D/A 1x8b | A/D 12x10b; D/A 1x8b |
Package protegéieren | Tube | Tube | Tape & Reel (TR) | Tube |
Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 125°C (TA) |
Peripheralien | Brown-out Detect/Reset, POR, PWM, WDT | Brown-out Detect/Reset, POR, PWM, WDT | Brown-out Detect/Reset, POR, PWM, WDT | Brown-out Detect/Reset, POR, PWM, WDT |
Mounting Type | Through Hole | Surface Mount | Surface Mount | Surface Mount |
Programmspeichergréisst | 7KB (4K x 14) | 14KB (8K x 14) | 7KB (4K x 14) | 14KB (8K x 14) |
Core Prozessor | PIC | PIC | PIC | PIC |
EEPROM Gréisst | - | - | - | - |
Oszilléierertyp | Internal | Internal | Internal | Internal |
Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
Serie | PIC® XLP™ 16F | PIC® XLP™ 16F | PIC® XLP™ 16F | PIC® XLP™ 16F |
Eroflueden PIC16LF1713-I/SP PDF DataDhusts an Microchip Technology Dokumentatioun fir PIC16LF1713-I/SP - Microchip Technology.
Allgemeng Länner Login logistesch Zäit Referenz | ||
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Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
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Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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