MCP606T-I/SN Tech Spezifikatioune
Microchip Technology - MCP606T-I/SN technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Microchip Technology - MCP606T-I/SN
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | Microchip Technology | |
Spannung - Versuergungspann (min) | 2.5 V | |
Spannung - Versuergungspann (Max) | 6 V | |
Voltage - Input Offset | 250 µV | |
Supplier Device Package | 8-SOIC | |
Slew Rate | 0.08V/µs | |
Serie | - | |
Package / Case | 8-SOIC (0.154", 3.90mm Width) | |
Package protegéieren | Tape & Reel (TR) | |
Ausgängegkeet | Rail-to-Rail |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Operatioun Temperatur | -40°C ~ 85°C | |
Zuel vu Circuits | 1 | |
Mounting Type | Surface Mount | |
Band Bandbreed Produkt | 155 kHz | |
Aktuell - Versioun | 18.7µA | |
Aktuell - Ausgab / Kanal | 17 mA | |
Aktuell - Input Bias | 1 pA | |
Basis Produktnummer | MCP606 | |
Verstäerkungstyp | General Purpose |
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Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | MCP606T-I/SN | MCP6062T-E/SN | MCP6064T-E/ST | MCP6071-E/SN |
Hiersteller | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
Verstäerkungstyp | General Purpose | CMOS | CMOS | General Purpose |
Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Spannung - Versuergungspann (min) | 2.5 V | 1.8 V | 1.8 V | 1.8 V |
Spannung - Versuergungspann (Max) | 6 V | 6 V | 6 V | 6 V |
Serie | - | - | - | - |
Voltage - Input Offset | 250 µV | 150 µV | 150 µV | 150 µV |
Zuel vu Circuits | 1 | 2 | 4 | 1 |
Basis Produktnummer | MCP606 | MCP6062 | MCP6064 | MCP6071 |
Package / Case | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC (0.154", 3.90mm Width) | 14-TSSOP (0.173", 4.40mm Width) | 8-SOIC (0.154", 3.90mm Width) |
Band Bandbreed Produkt | 155 kHz | 730 kHz | 730 kHz | 1.2 MHz |
Package protegéieren | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) | Tube |
Slew Rate | 0.08V/µs | 0.25V/µs | 0.25V/µs | 0.5V/µs |
Aktuell - Versioun | 18.7µA | 60µA (x2 Channels) | 60µA (x4 Channels) | 110µA |
Aktuell - Input Bias | 1 pA | 1 pA | 1 pA | 1 pA |
Supplier Device Package | 8-SOIC | 8-SOIC | 14-TSSOP | 8-SOIC |
Ausgängegkeet | Rail-to-Rail | Rail-to-Rail | Rail-to-Rail | Rail-to-Rail |
Aktuell - Ausgab / Kanal | 17 mA | 27 mA | 27 mA | - |
Operatioun Temperatur | -40°C ~ 85°C | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 125°C |
Eroflueden MCP606T-I/SN PDF DataDhusts an Microchip Technology Dokumentatioun fir MCP606T-I/SN - Microchip Technology.
Allgemeng Länner Login logistesch Zäit Referenz | ||
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Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
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Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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