MCP602T-I/SN Tech Spezifikatioune
Microchip Technology - MCP602T-I/SN technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Microchip Technology - MCP602T-I/SN
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | Microchip Technology | |
Spannung - Versuergungspann (min) | 2.7 V | |
Spannung - Versuergungspann (Max) | 6 V | |
Voltage - Input Offset | 700 µV | |
Supplier Device Package | 8-SOIC | |
Slew Rate | 2.3V/µs | |
Serie | - | |
Package / Case | 8-SOIC (0.154", 3.90mm Width) | |
Package protegéieren | Tape & Reel (TR) | |
Ausgängegkeet | Rail-to-Rail |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Operatioun Temperatur | -40°C ~ 85°C (TA) | |
Zuel vu Circuits | 2 | |
Mounting Type | Surface Mount | |
Band Bandbreed Produkt | 2.8 MHz | |
Aktuell - Versioun | 230µA (x2 Channels) | |
Aktuell - Ausgab / Kanal | 22 mA | |
Aktuell - Input Bias | 1 pA | |
Basis Produktnummer | MCP602 | |
Verstäerkungstyp | CMOS |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Microchip Technology MCP602T-I/SN.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | MCP602T-I/SN | MCP602T-I/ST | MCP603-I/P | MCP603-I/SN |
Hiersteller | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
Band Bandbreed Produkt | 2.8 MHz | 2.8 MHz | 2.8 MHz | 2.8 MHz |
Supplier Device Package | 8-SOIC | 8-TSSOP | 8-PDIP | 8-SOIC |
Serie | - | - | - | - |
Aktuell - Input Bias | 1 pA | 1 pA | 1 pA | 1 pA |
Zuel vu Circuits | 2 | 2 | 1 | 1 |
Basis Produktnummer | MCP602 | MCP602 | MCP603 | MCP603 |
Verstäerkungstyp | CMOS | CMOS | General Purpose | General Purpose |
Ausgängegkeet | Rail-to-Rail | Rail-to-Rail | Rail-to-Rail | Rail-to-Rail |
Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C | -40°C ~ 85°C |
Voltage - Input Offset | 700 µV | 700 µV | 700 µV | 700 µV |
Spannung - Versuergungspann (Max) | 6 V | 6 V | 6 V | 6 V |
Slew Rate | 2.3V/µs | 2.3V/µs | 2.3V/µs | 2.3V/µs |
Mounting Type | Surface Mount | Surface Mount | Through Hole | Surface Mount |
Package / Case | 8-SOIC (0.154", 3.90mm Width) | 8-TSSOP (0.173", 4.40mm Width) | 8-DIP (0.300", 7.62mm) | 8-SOIC (0.154", 3.90mm Width) |
Aktuell - Versioun | 230µA (x2 Channels) | 230µA (x2 Channels) | 230µA | 230µA |
Spannung - Versuergungspann (min) | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
Package protegéieren | Tape & Reel (TR) | Tape & Reel (TR) | Tube | Tube |
Aktuell - Ausgab / Kanal | 22 mA | 22 mA | 22 mA | 22 mA |
Eroflueden MCP602T-I/SN PDF DataDhusts an Microchip Technology Dokumentatioun fir MCP602T-I/SN - Microchip Technology.
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1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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