DSPIC33EP32GS502-I/MM Tech Spezifikatioune
Microchip Technology - DSPIC33EP32GS502-I/MM technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Microchip Technology - DSPIC33EP32GS502-I/MM
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | Microchip Technology | |
Voltage - Versorgung (Vcc / Vdd) | 3V ~ 3.6V | |
Supplier Device Package | 28-QFN-S (6x6) | |
Speed | 70 MIPs | |
Serie | dsPIC™ 33EP, Functional Safety (FuSa) | |
RAM Gréisst | 4K x 8 | |
Programm Memory Type | FLASH | |
Programmspeichergréisst | 32KB (32K x 8) | |
Peripheralien | Brown-out Detect/Reset, POR, PWM, WDT | |
Package / Case | 28-VQFN Exposed Pad | |
Package protegéieren | Tube |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Oszilléierertyp | Internal | |
Operatioun Temperatur | -40°C ~ 85°C (TA) | |
Zuel vun I / O | 21 | |
Mounting Type | Surface Mount | |
EEPROM Gréisst | - | |
Datenkonverter | A/D 12x12b; D/A 1x12b | |
Core Size | 16-Bit | |
Core Prozessor | dsPIC | |
Konnektivitéit | I²C, IrDA, LINbus, SPI, UART/USART | |
Basis Produktnummer | DSPIC33EP32GS502 |
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Produktiounsattriff | ||||
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Part Number | DSPIC33EP32GS502-I/MM | DSPIC33EP32GS202T-I/SO | DSPIC33EP32GS504-I/PT | DSPIC33EP32GS504-I/ML |
Hiersteller | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
Package / Case | 28-VQFN Exposed Pad | 28-SOIC (0.295", 7.50mm Width) | 44-TQFP | 44-VQFN Exposed Pad |
Konnektivitéit | I²C, IrDA, LINbus, SPI, UART/USART | I²C, IrDA, LINbus, SPI, UART/USART | I²C, IrDA, LINbus, SPI, UART/USART | I²C, IrDA, LINbus, SPI, UART/USART |
Peripheralien | Brown-out Detect/Reset, POR, PWM, WDT | Brown-out Detect/Reset, POR, PWM, WDT | Brown-out Detect/Reset, POR, PWM, WDT | Brown-out Detect/Reset, POR, PWM, WDT |
Datenkonverter | A/D 12x12b; D/A 1x12b | A/D 12x12b; D/A 2x12b | A/D 19x12b; D/A 1x12b | A/D 19x12b; D/A 1x12b |
Oszilléierertyp | Internal | Internal | Internal | Internal |
Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
RAM Gréisst | 4K x 8 | 2K x 8 | 4K x 8 | 4K x 8 |
Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 85°C | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
Core Prozessor | dsPIC | dsPIC | dsPIC | dsPIC |
Basis Produktnummer | DSPIC33EP32GS502 | DSPIC33EP32GS202 | DSPIC33EP32GS504 | DSPIC33EP32GS504 |
EEPROM Gréisst | - | - | - | - |
Programm Memory Type | FLASH | FLASH | FLASH | FLASH |
Zuel vun I / O | 21 | 21 | 35 | 35 |
Programmspeichergréisst | 32KB (32K x 8) | 32KB (32K x 8) | 32KB (32K x 8) | 32KB (32K x 8) |
Serie | dsPIC™ 33EP, Functional Safety (FuSa) | dsPIC™ 33EP, Functional Safety (FuSa) | dsPIC™ 33EP, Functional Safety (FuSa) | dsPIC™ 33EP, Functional Safety (FuSa) |
Core Size | 16-Bit | 16-Bit | 16-Bit | 16-Bit |
Voltage - Versorgung (Vcc / Vdd) | 3V ~ 3.6V | 3V ~ 3.6V | 3V ~ 3.6V | 3V ~ 3.6V |
Speed | 70 MIPs | 70 MIPs | 70 MIPs | 70 MIPs |
Supplier Device Package | 28-QFN-S (6x6) | 28-SOIC | 44-TQFP (10x10) | 44-QFN (8x8) |
Package protegéieren | Tube | Tape & Reel (TR) | Tray | Tube |
Eroflueden DSPIC33EP32GS502-I/MM PDF DataDhusts an Microchip Technology Dokumentatioun fir DSPIC33EP32GS502-I/MM - Microchip Technology.
Allgemeng Länner Login logistesch Zäit Referenz | ||
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Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
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Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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