BZV55C8V2 Tech Spezifikatioune
Microchip Technology - BZV55C8V2 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Microchip Technology - BZV55C8V2
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | Microchip Technology | |
| Voltage - Zener (nom) (Vz) | 8.2 V | |
| Voltage - Viru (Vf) (Max) @ Wann | 1.1 V @ 200 mA | |
| Toleranz | ±6% | |
| Supplier Device Package | DO-213AA | |
| Serie | - |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Package / Case | DO-213AA (Glass) | |
| Package protegéieren | Bulk | |
| Operatioun Temperatur | -65°C ~ 175°C | |
| Mounting Type | Surface Mount | |
| Aktuell - Reverse Leakage @ Vr | 700 nA @ 5 V | |
| Basis Produktnummer | BZV55C8V2 |
| ATTRESSIOUN | BESCHREIWUNG |
|---|---|
| RoHs Status | RoHS net konform |
| Fiichtegkeet Sensibilitéitsniveau (MSL) | 1 (Unlimited) |
| Erreecht Status | REACH Unaffected |
| ECCN | EAR99 |
| HTSUS |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Microchip Technology BZV55C8V2.
| Produktiounsattriff |  |
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|---|---|---|---|---|
| Part Number | BZV55C8V2 | BZV55C7V5 | BZV55C6V8 | BZV55C6V8 |
| Hiersteller | Microchip Technology | Taiwan Semiconductor Corporation | Taiwan Semiconductor Corporation | Microchip Technology |
| Supplier Device Package | DO-213AA | Mini MELF | Mini MELF | DO-213AA |
| Operatioun Temperatur | -65°C ~ 175°C | -65°C ~ 175°C (TJ) | -65°C ~ 175°C (TJ) | -65°C ~ 175°C |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Package / Case | DO-213AA (Glass) | DO-213AC, MINI-MELF, SOD-80 | DO-213AC, MINI-MELF, SOD-80 | DO-213AA (Glass) |
| Aktuell - Reverse Leakage @ Vr | 700 nA @ 5 V | 100 nA @ 5 V | 100 nA @ 3 V | 2 µA @ 4 V |
| Toleranz | ±6% | ±5% | ±5% | ±6% |
| Serie | - | - | - | - |
| Voltage - Zener (nom) (Vz) | 8.2 V | 7.5 V | 6.8 V | 6.8 V |
| Basis Produktnummer | BZV55C8V2 | BZV55C | BZV55C | BZV55C6V8 |
| Voltage - Viru (Vf) (Max) @ Wann | 1.1 V @ 200 mA | 1 V @ 10 mA | 1 V @ 10 mA | 1.1 V @ 200 mA |
| Package protegéieren | Bulk | Tape & Reel (TR) | Tape & Reel (TR) | Bulk |
Eroflueden BZV55C8V2 PDF DataDhusts an Microchip Technology Dokumentatioun fir BZV55C8V2 - Microchip Technology.
BZV55C7V5Taiwan Semiconductor CorporationMMELF, 500MW, 5%, SMALL SIGNAL Z
BZV85-C10Freescale / NXP SemiconductorsBZV55C6V8Taiwan Semiconductor CorporationMMELF, 500MW, 5%, SMALL SIGNAL ZBZV55C6V8Microchip TechnologyDIODE ZENER 6.8V DO213AABZV55C75 L1Taiwan Semiconductor
BZV85-C11PHIBZV55C7V5Microchip TechnologyDIODE ZENER 7.5V DO213AABZV55C5V6Microchip TechnologyDIODE ZENER 5.6V DO213AABZV55C9V1Taiwan Semiconductor CorporationMMELF, 500MW, 5%, SMALL SIGNAL ZBZV55C5V6Taiwan Semiconductor CorporationMMELF, 500MW, 5%, SMALL SIGNAL Z
BZV85-C10,113Nexperia USA Inc.DIODE ZENER 10V 1.3W DO41BZV55C6V2-TRCOMPLIANT
BZV85-C11133NexperiaBZV85-C10.113NexperiaBZV55C8V2Taiwan Semiconductor CorporationMMELF, 500MW, 5%, SMALL SIGNAL ZBZV55C9V1Microchip TechnologyDIODE ZENER 9.1V DO213AABZV85-C10,113NXP USA Inc.DIODE ZENER 10V 1.3W DO41BZV79-C22Freescale / NXP Semiconductors| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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