APTGT300DA60G Tech Spezifikatioune
Microchip Technology - APTGT300DA60G technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Microchip Technology - APTGT300DA60G
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | Microchip Technology | |
| Voltage - Collector Emitter Breakdown (Max) | 600 V | |
| Vce (on) (Max) @ Vge, Ic | 1.8V @ 15V, 300A | |
| Supplier Device Package | SP6 | |
| Serie | - | |
| Power - Max | 1150 W | |
| Package / Case | SP6 | |
| Package protegéieren | Bulk | |
| Operatioun Temperatur | -40°C ~ 175°C (TJ) |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| NTC Thermistor | No | |
| Mounting Type | Chassis Mount | |
| Input Capacitance (Cies) @ Vce | 24 nF @ 25 V | |
| Input | Standard | |
| IGBT Type | Trench Field Stop | |
| Aktuell - Kollektorat Cutoff (Max) | 350 µA | |
| Aktuell - Sammler (Ic) (Max) | 430 A | |
| Konfiguratioun | Single | |
| Basis Produktnummer | APTGT300 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Microchip Technology APTGT300DA60G.
| Produktiounsattriff |  |
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|---|---|---|---|---|
| Part Number | APTGT300DA60G | APTGT25A120D1G | APTGT30A170D1G | APTGT25SK120D1G |
| Hiersteller | Microchip Technology | Microsemi Corporation | Microsemi Corporation | Microsemi Corporation |
| Konfiguratioun | Single | Half Bridge | Half Bridge | Single |
| Basis Produktnummer | APTGT300 | - | - | - |
| Voltage - Collector Emitter Breakdown (Max) | 600 V | 1200 V | 1700 V | 1200 V |
| Aktuell - Kollektorat Cutoff (Max) | 350 µA | 5 mA | 3 mA | 5 mA |
| Supplier Device Package | SP6 | D1 | D1 | D1 |
| Power - Max | 1150 W | 140 W | 210 W | 140 W |
| IGBT Type | Trench Field Stop | Trench Field Stop | Trench Field Stop | Trench Field Stop |
| NTC Thermistor | No | No | No | No |
| Package / Case | SP6 | D1 | D1 | D1 |
| Mounting Type | Chassis Mount | Chassis Mount | Chassis Mount | Chassis Mount |
| Vce (on) (Max) @ Vge, Ic | 1.8V @ 15V, 300A | 2.1V @ 15V, 25A | 2.4V @ 15V, 30A | 2.1V @ 15V, 25A |
| Operatioun Temperatur | -40°C ~ 175°C (TJ) | - | - | - |
| Package protegéieren | Bulk | Bulk | Bulk | Bulk |
| Aktuell - Sammler (Ic) (Max) | 430 A | 40 A | 45 A | 40 A |
| Input | Standard | Standard | Standard | Standard |
| Serie | - | - | - | - |
| Input Capacitance (Cies) @ Vce | 24 nF @ 25 V | 1.8 nF @ 25 V | 2.5 nF @ 25 V | 1.8 nF @ 25 V |
Eroflueden APTGT300DA60G PDF DataDhusts an Microchip Technology Dokumentatioun fir APTGT300DA60G - Microchip Technology.
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APTGT300A170GMicrochip TechnologyIGBT MODULE 1700V 400A 1660W SP6APTGT200U170D4GAPTIGBT ModuleAPTGT30H60T1GMicrochip TechnologyIGBT MODULE 600V 50A 90W SP1APTGT300U170D4GAPTIGBT ModuleAPTGT300U120D4GAPTIGBT ModuleAPTGT300DA120D3GMicrosemi CorporationIGBT MODULE 1200V 440A 1250W D3APTGT300A170D3GMicrochip TechnologyIGBT MODULE 1700V 530A 1470W D3APTGT300TL60GMicrochip TechnologyIGBT MODULE 600V 400A 935W SP6APTGT300DA170D3GMicrochip TechnologyIGBT MODULE 1700V 530A 1470W D3APTGT300A60WGAPTIGBT Module| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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