23LCV1024-I/SN Tech Spezifikatioune
Microchip Technology - 23LCV1024-I/SN technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Microchip Technology - 23LCV1024-I/SN
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | Microchip Technology | |
| Schreiwe Cycle Time - Word, Page | - | |
| Voltage - Supply | 2.5V ~ 5.5V | |
| Technologie | SRAM - Synchronous | |
| Supplier Device Package | 8-SOIC | |
| Serie | - | |
| Package / Case | 8-SOIC (0.154', 3.90mm Width) | |
| Package protegéieren | Tube | |
| Operatioun Temperatur | -40°C ~ 85°C (TA) |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Mounting Type | Surface Mount | |
| Gedächtnis Type | Volatile | |
| Späichergréisst | 1Mbit | |
| Erënnerungsorganisatioun | 128K x 8 | |
| Memory Interface | SPI - Dual I/O | |
| Memory Format | SRAM | |
| Clock Frequency | 20 MHz | |
| Basis Produktnummer | 23LCV1024 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Microchip Technology 23LCV1024-I/SN.
| Produktiounsattriff |  |
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|---|---|---|---|---|
| Part Number | 23LCV1024-I/SN | 23LC512-I/SN | 23LCV512-I/ST | 23LCV1024-I/ST |
| Hiersteller | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Serie | - | - | - | - |
| Memory Interface | SPI - Dual I/O | SPI - Quad I/O | SPI - Dual I/O | SPI - Dual I/O |
| Späichergréisst | 1Mbit | 512Kbit | 512Kbit | 1Mbit |
| Clock Frequency | 20 MHz | 20 MHz | 20 MHz | 20 MHz |
| Voltage - Supply | 2.5V ~ 5.5V | 2.5V ~ 5.5V | 2.5V ~ 5.5V | 2.5V ~ 5.5V |
| Basis Produktnummer | 23LCV1024 | 23LC512 | 23LCV512 | 23LCV1024 |
| Memory Format | SRAM | SRAM | SRAM | SRAM |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Technologie | SRAM - Synchronous | SRAM | SRAM - Synchronous | SRAM - Synchronous |
| Gedächtnis Type | Volatile | Volatile | Volatile | Volatile |
| Erënnerungsorganisatioun | 128K x 8 | 64K x 8 | 64K x 8 | 128K x 8 |
| Package protegéieren | Tube | Tube | Tube | Tube |
| Schreiwe Cycle Time - Word, Page | - | - | - | - |
| Package / Case | 8-SOIC (0.154', 3.90mm Width) | 8-SOIC (0.154', 3.90mm Width) | 8-TSSOP (0.173", 4.40mm Width) | 8-TSSOP (0.173", 4.40mm Width) |
| Supplier Device Package | 8-SOIC | 8-SOIC | 8-TSSOP | 8-TSSOP |
Eroflueden 23LCV1024-I/SN PDF DataDhusts an Microchip Technology Dokumentatioun fir 23LCV1024-I/SN - Microchip Technology.
23LCV1024T-I/STMicrochip23LCV512-I/PMicrochip23LC512-E/SNMicrochip23LCB-I/SNMicrel / Microchip Technology
23LCVB-I/SNMICROCIHIP23LC512T-I/SNMicrochip23LC512-I/SNMicrochip TechnologyIC SRAM 512KBIT SPI/QUAD 8SOIC23LC512T-I/STMicrochip23LC512-I/PMicrochip23LCV512-I/SNMicrochip23LGT00B30NVIDIA23LCV512-I/STMicrochip TechnologyIC SRAM 512KBIT SPI/DUAL 8TSSOP23LCV1024-I/PMicrochip23LCV512T-I/SNMicrochip23LCV1024-I/STMicrochip TechnologyIC SRAM 1MBIT SPI/DUAL 8TSSOP23LC512T-E/SNMicrochip23LCV1024T-I/SNMicrochip23LC512-I/STMicrochip TechnologyIC SRAM 512KBIT SPI/QUAD 8TSSOP| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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