TCFGB0J226M8R Tech Spezifikatioune
Rohm Semiconductor - TCFGB0J226M8R technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Rohm Semiconductor - TCFGB0J226M8R
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | LAPIS Technology | |
| Voltage - bewäert | 6.3 V | |
| Typ | Molded | |
| Toleranz | ±20% | |
| Gréisst / Dimensioun | 0.138' L x 0.110' W (3.50mm x 2.80mm) | |
| Serie | TCFG | |
| Package / Case | 1411 (3528 Metric) | |
| Package protegéieren | Tape & Reel (TR) | |
| Operatioun Temperatur | -55°C ~ 125°C |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Mounting Type | Surface Mount | |
| Fabrikatgréisst Code | B | |
| Lifetime @ Temp. | - | |
| Lead Abstand | - | |
| Héicht - Sëtz (Max) | 0.083' (2.10mm) | |
| Eegeschaften | Fail Safe with Built-in Fuse | |
| Failure Rate | - | |
| ESR (equivalent Serie Resistance) | - | |
| Kapazitéit | 22 µF |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Rohm Semiconductor TCFGB0J226M8R.
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|---|---|---|---|---|
| Part Number | TCFGB0J226M8R | TCFGB0J107M8R | TCFGB0J336M8R | TCFGB1A106M8R |
| Hiersteller | Rohm Semiconductor | Rohm Semiconductor | Rohm Semiconductor | Rohm Semiconductor |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Kapazitéit | 22 µF | 100 µF | 33 µF | 10 µF |
| Package / Case | 1411 (3528 Metric) | 1411 (3528 Metric) | 1411 (3528 Metric) | 1411 (3528 Metric) |
| ESR (equivalent Serie Resistance) | - | - | - | - |
| Operatioun Temperatur | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C |
| Lead Abstand | - | - | - | - |
| Toleranz | ±20% | ±20% | ±20% | ±20% |
| Héicht - Sëtz (Max) | 0.083' (2.10mm) | 0.083' (2.10mm) | 0.083' (2.10mm) | 0.083' (2.10mm) |
| Gréisst / Dimensioun | 0.138' L x 0.110' W (3.50mm x 2.80mm) | 0.138' L x 0.110' W (3.50mm x 2.80mm) | 0.138' L x 0.110' W (3.50mm x 2.80mm) | 0.138' L x 0.110' W (3.50mm x 2.80mm) |
| Lifetime @ Temp. | - | - | - | - |
| Package protegéieren | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) |
| Typ | Molded | Molded | Molded | Molded |
| Serie | TCFG | TCFG | TCFG | TCFG |
| Eegeschaften | Fail Safe with Built-in Fuse | Fail Safe with Built-in Fuse | Fail Safe with Built-in Fuse | Fail Safe with Built-in Fuse |
| Fabrikatgréisst Code | B | B | B | B |
| Failure Rate | - | - | - | - |
| Voltage - bewäert | 6.3 V | 6.3 V | 6.3 V | 10 V |
Eroflueden TCFGB0J226M8R PDF DataDhusts an Rohm Semiconductor Dokumentatioun fir TCFGB0J226M8R - Rohm Semiconductor.
TCFGB0J156M8RLAPIS TechnologyTCFGB0G476M8RLAPIS TechnologyTCFGB0J107M8RRohm SemiconductorCAP TANT 100UF 20% 6.3V 1411TCFGB0J336M8RRohm SemiconductorCAP TANT 33UF 20% 6.3V 1411TCFGB0J227M8R-Y1LAPIS TechnologyTCFGB1A106M8RRohm SemiconductorCAP TANT 10UF 20% 10V 1411TCFGB1A476M8RRohm SemiconductorCAP TANT 47UF 20% 10V 1411
TCFGA1C106M8RRohm SemiconductorCAP TANT 10UF 20% 16V 1206TCFGB1A107M8RRohm SemiconductorCAP TANT 100UF 20% 10V 1411TCFGB1C106M8RRohm SemiconductorCAP TANT 10UF 20% 16V 1411TCFGA1C105M8RRohm SemiconductorCAP TANT 1UF 20% 16V 1206TCFGB0J686M8RRohm SemiconductorCAP TANT 68UF 20% 6.3V 1411TCFGB1A1061M8RLAPIS TechnologyTCFGA1C475M8RRohm SemiconductorCAP TANT 4.7UF 20% 16V 1206TCFGA1C225M8RRohm SemiconductorCAP TANT 2.2UF 20% 16V 1206
TCFGAOJ335M8RR0HMTCFGB1A226M8RRohm SemiconductorCAP TANT 22UF 20% 10V 1411TCFGB0G227M8RRohm SemiconductorCAP TANT 220UF 20% 4V 1411| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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