RHK005N03T146 Tech Spezifikatioune
Rohm Semiconductor - RHK005N03T146 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Rohm Semiconductor - RHK005N03T146
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | LAPIS Technology | |
Vgs (th) (Max) @ Id | 2.5V @ 1mA | |
Vgs (Max) | ±20V | |
Technologie | MOSFET (Metal Oxide) | |
Supplier Device Package | SMT3 | |
Serie | - | |
Rds On (Max) @ Id, Vgs | 550mOhm @ 500mA, 10V | |
Power Dissipation (Max) | 200mW (Ta) | |
Package / Case | TO-236-3, SC-59, SOT-23-3 | |
Package protegéieren | Tape & Reel (TR) |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Operatioun Temperatur | 150°C (TJ) | |
Mounting Type | Surface Mount | |
Input Capacitance (Ciss) (Max) @ Vds | 45 pF @ 10 V | |
FET Typ | N-Channel | |
FET Feature | - | |
Fuert Volt (Max Rds On, Min Rds On) | 4V, 10V | |
Entworf fir Source Voltage (Vdss) | 30 V | |
Aktuell - Kontinuéierter Drain (Id) @ 25 ° C | 500mA (Ta) | |
Basis Produktnummer | RHK005 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Rohm Semiconductor RHK005N03T146.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | RHK005N03T146 | IRF2804STRRPBF | FQPF4N50 | FDB8874 |
Hiersteller | Rohm Semiconductor | Infineon Technologies | onsemi | onsemi |
Supplier Device Package | SMT3 | D2PAK | TO-220F-3 | D²PAK (TO-263) |
Rds On (Max) @ Id, Vgs | 550mOhm @ 500mA, 10V | 2mOhm @ 75A, 10V | 2.7Ohm @ 1.15A, 10V | 4.7mOhm @ 40A, 10V |
Vgs (Max) | ±20V | ±20V | ±30V | ±20V |
Entworf fir Source Voltage (Vdss) | 30 V | 40 V | 500 V | 30 V |
Operatioun Temperatur | 150°C (TJ) | -55°C ~ 175°C (TJ) | -55°C ~ 150°C (TJ) | -55°C ~ 175°C (TJ) |
Vgs (th) (Max) @ Id | 2.5V @ 1mA | 4V @ 250µA | 5V @ 250µA | 2.5V @ 250µA |
FET Feature | - | - | - | - |
Power Dissipation (Max) | 200mW (Ta) | 300W (Tc) | 35W (Tc) | 110W (Tc) |
Package protegéieren | Tape & Reel (TR) | Tape & Reel (TR) | Tube | Tape & Reel (TR) |
Fuert Volt (Max Rds On, Min Rds On) | 4V, 10V | 10V | 10V | 4.5V, 10V |
Package / Case | TO-236-3, SC-59, SOT-23-3 | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB | TO-220-3 Full Pack | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
Mounting Type | Surface Mount | Surface Mount | Through Hole | Surface Mount |
Input Capacitance (Ciss) (Max) @ Vds | 45 pF @ 10 V | 6450 pF @ 25 V | 460 pF @ 25 V | 3130 pF @ 15 V |
Serie | - | HEXFET® | QFET® | PowerTrench® |
FET Typ | N-Channel | N-Channel | N-Channel | N-Channel |
Aktuell - Kontinuéierter Drain (Id) @ 25 ° C | 500mA (Ta) | 75A (Tc) | 2.3A (Tc) | 21A (Ta), 121A (Tc) |
Basis Produktnummer | RHK005 | IRF2804 | FQPF4 | FDB887 |
Technologie | MOSFET (Metal Oxide) | MOSFET (Metal Oxide) | MOSFET (Metal Oxide) | MOSFET (Metal Oxide) |
Eroflueden RHK005N03T146 PDF DataDhusts an Rohm Semiconductor Dokumentatioun fir RHK005N03T146 - Rohm Semiconductor.
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Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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