BU9847GUL-WE2 Tech Spezifikatioune
Rohm Semiconductor - BU9847GUL-WE2 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Rohm Semiconductor - BU9847GUL-WE2
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | LAPIS Technology | |
| Schreiwe Cycle Time - Word, Page | 5ms | |
| Voltage - Supply | 1.7V ~ 5.5V | |
| Technologie | EEPROM | |
| Supplier Device Package | VCSP50L1 | |
| Serie | - | |
| Package / Case | 6-UFBGA, CSPBGA | |
| Package protegéieren | Tape & Reel (TR) | |
| Operatioun Temperatur | -40°C ~ 85°C (TA) |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Mounting Type | Surface Mount | |
| Gedächtnis Type | Non-Volatile | |
| Späichergréisst | 4Kbit | |
| Erënnerungsorganisatioun | 512 x 8 | |
| Memory Interface | I²C | |
| Memory Format | EEPROM | |
| Clock Frequency | 400 kHz | |
| Basis Produktnummer | BU9847 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Rohm Semiconductor BU9847GUL-WE2.
| Produktiounsattriff |  |
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|---|---|---|---|---|
| Part Number | BU9847GUL-WE2 | BU9829GUL-WE2 | BU9832GUL-WE2 | BU9833GUL-WE2 |
| Hiersteller | Rohm Semiconductor | Rohm Semiconductor | Rohm Semiconductor | Rohm Semiconductor |
| Erënnerungsorganisatioun | 512 x 8 | 2K x 8 | 1K x 8 | 256 x 8 |
| Basis Produktnummer | BU9847 | BU9829 | BU9832 | BU9833 |
| Supplier Device Package | VCSP50L1 | 9-VCSP50L1 (1.6x1.6) | 8-VCSP50L2 (2.09x1.85) | VCSP50L1 |
| Package protegéieren | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) |
| Technologie | EEPROM | EEPROM | EEPROM | EEPROM |
| Serie | - | - | - | - |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Gedächtnis Type | Non-Volatile | Non-Volatile | Non-Volatile | Non-Volatile |
| Schreiwe Cycle Time - Word, Page | 5ms | 5ms | 5ms | 5ms |
| Clock Frequency | 400 kHz | 5 MHz | 5 MHz | 400 kHz |
| Voltage - Supply | 1.7V ~ 5.5V | 1.6V ~ 3.6V | 1.8V ~ 5.5V | 1.7V ~ 5.5V |
| Memory Interface | I²C | SPI | SPI | I²C |
| Memory Format | EEPROM | EEPROM | EEPROM | EEPROM |
| Späichergréisst | 4Kbit | 16Kbit | 8Kbit | 2Kbit |
| Package / Case | 6-UFBGA, CSPBGA | 9-UFBGA, WLCSP | 8-UFBGA, CSPBGA | 6-UFBGA, CSPBGA |
| Operatioun Temperatur | -40°C ~ 85°C (TA) | -30°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
Eroflueden BU9847GUL-WE2 PDF DataDhusts an Rohm Semiconductor Dokumentatioun fir BU9847GUL-WE2 - Rohm Semiconductor.
BU9871FV-E2LAPIS TechnologyBU9873FVT-GE3LAPIS Technology
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BU9799KV-E2Rohm SemiconductorIC DRVR 200 SEGMENT 64VQFP
BU9873FVM-GTTRRohm SemiconductorIC RTC CLK/CALENDAR I2C 8MSOPBU9871FV-WCE2LAPIS TechnologyBU9834GUL-WE2LAPIS TechnologyBU9838HFN-WTRLAPIS TechnologyBU9873NUXLAPIS Technology
BU9873FJ-GTE2Rohm SemiconductorIC RTC CLOCK/CALENDAR I2C 8SOPBU9837GUL-WE2LAPIS TechnologyBU9829GUL-WE2Rohm SemiconductorIC EEPROM 16KBIT SPI 9VCSP50L1BU9799KVLAPIS TechnologyBU9832GUL-WE2Rohm SemiconductorIC EEPROM 8KBIT SPI 8VCSP50L2BU9833GUL-WE2Rohm SemiconductorIC EEPROM 2KBIT I2C VCSP50L1BU9869W-02-TRLAPIS Technology| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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