BR24L08FV-WE2 Tech Spezifikatioune
Rohm Semiconductor - BR24L08FV-WE2 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Rohm Semiconductor - BR24L08FV-WE2
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | LAPIS Technology | |
| Schreiwe Cycle Time - Word, Page | 5ms | |
| Voltage - Supply | 1.8V ~ 5.5V | |
| Technologie | EEPROM | |
| Supplier Device Package | 8-SSOP-B | |
| Serie | - | |
| Package / Case | 8-LSSOP (0.173', 4.40mm Width) | |
| Package protegéieren | Tape & Reel (TR) | |
| Operatioun Temperatur | -40°C ~ 85°C (TA) |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Mounting Type | Surface Mount | |
| Gedächtnis Type | Non-Volatile | |
| Späichergréisst | 8Kbit | |
| Erënnerungsorganisatioun | 1K x 8 | |
| Memory Interface | I²C | |
| Memory Format | EEPROM | |
| Clock Frequency | 400 kHz | |
| Basis Produktnummer | BR24L08 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Rohm Semiconductor BR24L08FV-WE2.
| Produktiounsattriff |  |
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|---|---|---|---|---|
| Part Number | BR24L08FV-WE2 | BR24L04FV-WE2 | BR24L04FVM-WTR | BR24L08FJ-WE2 |
| Hiersteller | Rohm Semiconductor | Rohm Semiconductor | Rohm Semiconductor | Rohm Semiconductor |
| Technologie | EEPROM | EEPROM | EEPROM | EEPROM |
| Serie | - | - | - | - |
| Voltage - Supply | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 1.8V ~ 5.5V | 1.8V ~ 5.5V |
| Späichergréisst | 8Kbit | 4Kbit | 4Kbit | 8Kbit |
| Basis Produktnummer | BR24L08 | BR24L04 | BR24L04 | BR24L08 |
| Memory Format | EEPROM | EEPROM | EEPROM | EEPROM |
| Package protegéieren | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) |
| Supplier Device Package | 8-SSOP-B | 8-SSOP-B | 8-MSOP | 8-SOP-J |
| Memory Interface | I²C | I²C | I²C | I²C |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Clock Frequency | 400 kHz | 400 kHz | 400 kHz | 400 kHz |
| Schreiwe Cycle Time - Word, Page | 5ms | 5ms | 5ms | 5ms |
| Gedächtnis Type | Non-Volatile | Non-Volatile | Non-Volatile | Non-Volatile |
| Erënnerungsorganisatioun | 1K x 8 | 512 x 8 | 512 x 8 | 1K x 8 |
| Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Package / Case | 8-LSSOP (0.173', 4.40mm Width) | 8-LSSOP (0.173", 4.40mm Width) | 8-VSSOP, 8-MSOP (0.110", 2.80mm Width) | 8-SOIC (0.154', 3.90mm Width) |
Eroflueden BR24L08FV-WE2 PDF DataDhusts an Rohm Semiconductor Dokumentatioun fir BR24L08FV-WE2 - Rohm Semiconductor.
BR24L08F-WELAPIS TechnologyBR24L04FV-WE2Rohm SemiconductorIC EEPROM 4KBIT I2C 8SSOPBBR24L16LAPIS TechnologyBR24L04FVM-WTRRohm SemiconductorIC EEPROM 4KBIT I2C 400KHZ 8MSOPBR24L08FJ-WE2Rohm SemiconductorIC EEPROM 8KBIT I2C 400KHZ 8SOPJ
BR24L08F-WE2Rohm SemiconductorIC EEPROM 8KBIT I2C 400KHZ 8SOP
BR24L16-WRohm SemiconductorIC EEPROM 16KBIT I2C 400KHZ 8DIPBR24L04FJ-WE2Rohm SemiconductorIC EEPROM 4KBIT I2C 400KHZ 8SOPJBR24L08FVT-WSE2LAPIS TechnologyBR24L08FVM-TRLAPIS TechnologyBR24L08FVM-WTRRohm SemiconductorIC EEPROM 8KBIT I2C 400KHZ 8MSOPBR24L08GLU-WOE2LAPIS Technology
BR24L08FVT-WE2Rohm SemiconductorIC EEPROM 8KBIT I2C 8TSSOPB
BR24L04FVJ-WE2Rohm SemiconductorIC EEPROM 4KBIT I2C 8TSSOPBR24L04FV-WLAPIS TechnologyBR24L08LAPIS TechnologyBR24L16FLAPIS TechnologyBR24L16F-WE2Rohm SemiconductorIC EEPROM 16KBIT I2C 400KHZ 8SOP| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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