BR24G256FVT-3GE2 Tech Spezifikatioune
Rohm Semiconductor - BR24G256FVT-3GE2 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Rohm Semiconductor - BR24G256FVT-3GE2
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | LAPIS Technology | |
| Schreiwe Cycle Time - Word, Page | 5ms | |
| Voltage - Supply | 1.6V ~ 5.5V | |
| Technologie | EEPROM | |
| Supplier Device Package | 8-TSSOP-B | |
| Serie | - | |
| Package / Case | 8-TSSOP (0.173', 4.40mm Width) | |
| Package protegéieren | Tape & Reel (TR) | |
| Operatioun Temperatur | -40°C ~ 85°C (TA) |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Mounting Type | Surface Mount | |
| Gedächtnis Type | Non-Volatile | |
| Späichergréisst | 256Kbit | |
| Erënnerungsorganisatioun | 32K x 8 | |
| Memory Interface | I²C | |
| Memory Format | EEPROM | |
| Clock Frequency | 400 kHz | |
| Basis Produktnummer | BR24G256 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Rohm Semiconductor BR24G256FVT-3GE2.
| Produktiounsattriff |  |
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 |
 |
|---|---|---|---|---|
| Part Number | BR24G256FVT-3GE2 | BR24G256F-3GTE2 | BR24G32FVM-3GTTR | BR24G256FJ-3GTE2 |
| Hiersteller | Rohm Semiconductor | Rohm Semiconductor | Rohm Semiconductor | Rohm Semiconductor |
| Serie | - | - | - | - |
| Memory Format | EEPROM | EEPROM | EEPROM | EEPROM |
| Schreiwe Cycle Time - Word, Page | 5ms | 5ms | 5ms | 5ms |
| Späichergréisst | 256Kbit | 256Kbit | 32Kbit | 256Kbit |
| Clock Frequency | 400 kHz | 400 kHz | 400 kHz | 400 kHz |
| Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Supplier Device Package | 8-TSSOP-B | 8-SOP | 8-MSOP | 8-SOP-J |
| Voltage - Supply | 1.6V ~ 5.5V | 1.6V ~ 5.5V | 1.6V ~ 5.5V | 1.6V ~ 5.5V |
| Technologie | EEPROM | EEPROM | EEPROM | EEPROM |
| Basis Produktnummer | BR24G256 | BR24G256 | BR24G32 | BR24G256 |
| Memory Interface | I²C | I²C | I²C | I²C |
| Package protegéieren | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) |
| Gedächtnis Type | Non-Volatile | Non-Volatile | Non-Volatile | Non-Volatile |
| Erënnerungsorganisatioun | 32K x 8 | 32K x 8 | 4K x 8 | 32K x 8 |
| Package / Case | 8-TSSOP (0.173', 4.40mm Width) | 8-SOIC (0.173', 4.40mm Width) | 8-VSSOP, 8-MSOP (0.110", 2.80mm Width) | 8-SOIC (0.154', 3.90mm Width) |
Eroflueden BR24G256FVT-3GE2 PDF DataDhusts an Rohm Semiconductor Dokumentatioun fir BR24G256FVT-3GE2 - Rohm Semiconductor.
BR24G256F-3GTE2Rohm SemiconductorIC EEPROM 256KBIT I2C 8SOP
BR24G32FJ-3AGTE2LAPIS TechnologyBR24G256LAPIS TechnologyBR24G32FVM-3GTTRRohm SemiconductorIC EEPROM 32KBIT I2C 8MSOPBR24G256FJ-3GTE2Rohm SemiconductorIC EEPROM 256KBIT I2C 8SOPJBR24G256FJ-WE2LAPIS TechnologyBR24G32F-WE2LAPIS TechnologyBR24G32F-3GTE2Rohm SemiconductorIC EEPROM 32KBIT I2C 400KHZ 8SOPBR24G1MFJ-3AGTE2Rohm SemiconductorIC EEPROM 1MBIT I2C 1MHZ 8SOPJBR24G256F-3AGTE2Rohm SemiconductorIC EEPROM 256KBIT I2C 1MHZ 8SOP
BR24G256FV-3GTE2Rohm SemiconductorIC EEPROM 256KBIT I2C 8SSOPBBR24G32FJLAPIS TechnologyBR24G32FJ-3GTE2Rohm SemiconductorIC EEPROM 32KBIT I2C 8SOPJBR24G32FJ-3GTSZE2LAPIS TechnologyBR24G256TFJ-WE2LAPIS Technology
BR24G256FJ-3NSE2RLHMBR24G256FJ-3LAPIS TechnologyBR24G32FJ-WE2LAPIS Technology| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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