BR24G1MF-3AGTE2 Tech Spezifikatioune
Rohm Semiconductor - BR24G1MF-3AGTE2 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Rohm Semiconductor - BR24G1MF-3AGTE2
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | LAPIS Technology | |
| Schreiwe Cycle Time - Word, Page | 5ms | |
| Voltage - Supply | 1.7V ~ 5.5V | |
| Technologie | EEPROM | |
| Supplier Device Package | 8-SOP | |
| Serie | - | |
| Package / Case | 8-SOIC (0.173', 4.40mm Width) | |
| Package protegéieren | Tape & Reel (TR) | |
| Operatioun Temperatur | -40°C ~ 85°C (TA) |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Mounting Type | Surface Mount | |
| Gedächtnis Type | Non-Volatile | |
| Späichergréisst | 1Mbit | |
| Erënnerungsorganisatioun | 128K x 8 | |
| Memory Interface | I²C | |
| Memory Format | EEPROM | |
| Clock Frequency | 1 MHz | |
| Basis Produktnummer | BR24G1 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Rohm Semiconductor BR24G1MF-3AGTE2.
| Produktiounsattriff |  |
 |
|
 |
|---|---|---|---|---|
| Part Number | BR24G1MF-3AGTE2 | BR24G256FV-3GTE2 | BR24G256F-3AGTE2 | BR24G16NUX-3TTR |
| Hiersteller | Rohm Semiconductor | Rohm Semiconductor | Rohm Semiconductor | Rohm Semiconductor |
| Supplier Device Package | 8-SOP | 8-SSOP-B | 8-SOP | VSON008X2030 |
| Voltage - Supply | 1.7V ~ 5.5V | 1.6V ~ 5.5V | 1.7V ~ 5.5V | 1.6V ~ 5.5V |
| Package / Case | 8-SOIC (0.173', 4.40mm Width) | 8-LSSOP (0.173", 4.40mm Width) | 8-SOIC (0.173', 4.40mm Width) | 8-UFDFN Exposed Pad |
| Gedächtnis Type | Non-Volatile | Non-Volatile | Non-Volatile | Non-Volatile |
| Memory Format | EEPROM | EEPROM | EEPROM | EEPROM |
| Memory Interface | I²C | I²C | I²C | I²C |
| Basis Produktnummer | BR24G1 | BR24G256 | BR24G256 | BR24G16 |
| Clock Frequency | 1 MHz | 400 kHz | 1 MHz | 400 kHz |
| Schreiwe Cycle Time - Word, Page | 5ms | 5ms | 5ms | 5ms |
| Erënnerungsorganisatioun | 128K x 8 | 32K x 8 | 32K x 8 | 2K x 8 |
| Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
| Serie | - | - | - | - |
| Technologie | EEPROM | EEPROM | EEPROM | EEPROM |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Package protegéieren | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) |
| Späichergréisst | 1Mbit | 256Kbit | 256Kbit | 16Kbit |
Eroflueden BR24G1MF-3AGTE2 PDF DataDhusts an Rohm Semiconductor Dokumentatioun fir BR24G1MF-3AGTE2 - Rohm Semiconductor.
BR24G16FVT-W7130W2LAPIS TechnologyBR24G256FV-3GTE2Rohm SemiconductorIC EEPROM 256KBIT I2C 8SSOPBBR24G16FVT-W7156E2LAPIS TechnologyBR24G256F-3AGTE2Rohm SemiconductorIC EEPROM 256KBIT I2C 1MHZ 8SOPBR24G16NUX-3TTRRohm SemiconductorIC EEPROM 16KBIT VSON008X2030BR24G256FJ-WE2LAPIS Technology
BR24G256FJ-3NSE2RLHMBR24G16FV-3GTE2Rohm SemiconductorIC EEPROM 16KBIT I2C 8SSOPBBR24G16FVT-W7252E2LAPIS TechnologyBR24G16FVT-WE2LAPIS TechnologyBR24G256FJ-3LAPIS TechnologyBR24G256F-3GTE2Rohm SemiconductorIC EEPROM 256KBIT I2C 8SOPBR24G256LAPIS Technology
BR24G1MFJ-3AGTE2Rohm SemiconductorIC EEPROM 1MBIT I2C 1MHZ 8SOPJBR24G256FJ-3GTE2Rohm SemiconductorIC EEPROM 256KBIT I2C 8SOPJ
BR24G16FVM-3GTTRRohm SemiconductorIC EEPROM 16KBIT I2C 8MSOP
BR24G16FVT-3GE2Rohm SemiconductorIC EEPROM 16KBIT I2C 8TSSOPBR24G16FJ-WE2LAPIS Technology| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
Wëllt Dir e bessere Präis? A WED AN AMFE NEW, MELLT DIR DIR NËMMEN.