BR24C02FJ-WE2 Tech Spezifikatioune
Rohm Semiconductor - BR24C02FJ-WE2 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Rohm Semiconductor - BR24C02FJ-WE2
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | LAPIS Technology | |
| Schreiwe Cycle Time - Word, Page | 10ms | |
| Voltage - Supply | 2.7V ~ 5.5V | |
| Technologie | EEPROM | |
| Supplier Device Package | 8-SOP-J | |
| Serie | - | |
| Package / Case | 8-SOIC (0.154', 3.90mm Width) | |
| Package protegéieren | Tape & Reel (TR) | |
| Operatioun Temperatur | -40°C ~ 85°C (TA) |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Mounting Type | Surface Mount | |
| Gedächtnis Type | Non-Volatile | |
| Späichergréisst | 2Kbit | |
| Erënnerungsorganisatioun | 256 x 8 | |
| Memory Interface | I²C | |
| Memory Format | EEPROM | |
| Clock Frequency | 400 kHz | |
| Basis Produktnummer | BR24C02 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Rohm Semiconductor BR24C02FJ-WE2.
| Produktiounsattriff |  |
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|---|---|---|---|---|
| Part Number | BR24C02FJ-WE2 | BR24C02-RMN6TP | BR24C04-WMN6TP | BR24C02N-10SU-1.8 |
| Hiersteller | Rohm Semiconductor | Rohm Semiconductor | Rohm Semiconductor | LAPIS Technology |
| Package protegéieren | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) | - |
| Supplier Device Package | 8-SOP-J | 8-SOP | 8-SOP | - |
| Clock Frequency | 400 kHz | 100 kHz | 400 kHz | - |
| Späichergréisst | 2Kbit | 2Kbit | 4Kbit | - |
| Gedächtnis Type | Non-Volatile | Non-Volatile | Non-Volatile | - |
| Technologie | EEPROM | EEPROM | EEPROM | - |
| Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | - |
| Voltage - Supply | 2.7V ~ 5.5V | 1.8V ~ 5.5V | 2.5V ~ 5.5V | - |
| Erënnerungsorganisatioun | 256 x 8 | 256 x 8 | 512 x 8 | - |
| Serie | - | - | - | - |
| Memory Interface | I²C | I²C | I²C | - |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | - |
| Package / Case | 8-SOIC (0.154', 3.90mm Width) | 8-SOIC (0.154", 3.90mm Width) | 8-SOIC (0.154', 3.90mm Width) | - |
| Schreiwe Cycle Time - Word, Page | 10ms | 10ms | 5ms | - |
| Basis Produktnummer | BR24C02 | BR24C02 | BR24C04 | - |
| Memory Format | EEPROM | EEPROM | EEPROM | - |
Eroflueden BR24C02FJ-WE2 PDF DataDhusts an Rohm Semiconductor Dokumentatioun fir BR24C02FJ-WE2 - Rohm Semiconductor.
BR24C02N-10SU-1.8LAPIS TechnologyBR24C04F-E2LAPIS Technology
BR24C02F-E2PHILIPPINESBR24C02FV-WE2LAPIS TechnologyBR24C02F-WFE2BR24C04LAPIS TechnologyBR24C02-RMN6TPRohm SemiconductorIC EEPROM 2KBIT I2C 100KHZ 8SOBR24C04-WLAPIS TechnologyBR24C02FJLAPIS TechnologyBR24C04-WMN6TPRohm SemiconductorIC EEPROM 4KBIT I2C 400KHZ 8SOBR24C02F-WE2LAPIS TechnologyBR24C02WLAPIS TechnologyBR24C02LAPIS TechnologyBR24C02FV-WELAPIS TechnologyBR24C02F-W-PLAPIS TechnologyBR24C02F-WLAPIS TechnologyBR24C02FWLAPIS TechnologyBR24C02-WLAPIS Technology| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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