BD6387EFV-E2 Tech Spezifikatioune
Rohm Semiconductor - BD6387EFV-E2 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Rohm Semiconductor - BD6387EFV-E2
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | LAPIS Technology | |
Voltage - Supply | 10V ~ 28V | |
Voltage - Load | 10V ~ 28V | |
Technologie | DMOS | |
Supplier Device Package | 40-HTSSOP-B | |
Stëftungsbeschloss | 1, 1/2, 1/4 | |
Serie | - | |
Package / Case | 40-VSSOP (0.213", 5.40mm Width) Exposed Pad | |
Package protegéieren | Tape & Reel (TR) | |
Ausgabkonfiguratioun | Half Bridge (4) |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Operatioun Temperatur | -25°C ~ 150°C (TJ) | |
Mounting Type | Surface Mount | |
Motortyp - Stepp | Bipolar | |
Typ Type - AC, DC | Brushed DC | |
Interface | Parallel | |
Funktioun | Driver - Fully Integrated, Control and Power Stage | |
Aktuell - Ausgab | 1.7A | |
Basis Produktnummer | BD6387 | |
Applikatiounen | General Purpose |
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Produktiounsattriff | ||||
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Part Number | BD6387EFV-E2 | BD63940EFV-E2 | BD63876EFV-E2 | BD63873EFV-E2 |
Hiersteller | Rohm Semiconductor | Rohm Semiconductor | Rohm Semiconductor | Rohm Semiconductor |
Package / Case | 40-VSSOP (0.213", 5.40mm Width) Exposed Pad | 24-VSSOP (0.220", 5.60mm Width) Exposed Pad | 28-TSSOP (0.173", 4.40mm Width) Exposed Pad | 28-VSSOP (0.173", 4.40mm Width) Exposed Pad |
Stëftungsbeschloss | 1, 1/2, 1/4 | 1, 1/2 | 1, 1/2, 1/4 | 1, 1/2, 1/4 |
Typ Type - AC, DC | Brushed DC | - | - | - |
Basis Produktnummer | BD6387 | BD63940 | BD63876 | BD63873 |
Package protegéieren | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) |
Technologie | DMOS | DMOS | DMOS | DMOS |
Motortyp - Stepp | Bipolar | Bipolar | Bipolar | Bipolar |
Voltage - Load | 10V ~ 28V | 19V ~ 28V | 19V ~ 28V | 19V ~ 28V |
Applikatiounen | General Purpose | General Purpose | General Purpose | General Purpose |
Interface | Parallel | Parallel | Parallel | Serial |
Ausgabkonfiguratioun | Half Bridge (4) | Half Bridge (4) | Half Bridge (4) | Half Bridge (4) |
Funktioun | Driver - Fully Integrated, Control and Power Stage | Driver - Fully Integrated, Control and Power Stage | Driver - Fully Integrated, Control and Power Stage | Driver - Fully Integrated, Control and Power Stage |
Operatioun Temperatur | -25°C ~ 150°C (TJ) | -25°C ~ 150°C (TJ) | -25°C ~ 150°C (TJ) | -25°C ~ 150°C (TJ) |
Supplier Device Package | 40-HTSSOP-B | 24-HTSSOP-B | 28-HTSSOP | 28-HTSSOP-B |
Voltage - Supply | 10V ~ 28V | 19V ~ 28V | 19V ~ 28V | 19V ~ 28V |
Serie | - | - | - | - |
Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Aktuell - Ausgab | 1.7A | 900mA | 1.7A | 700mA |
Eroflueden BD6387EFV-E2 PDF DataDhusts an Rohm Semiconductor Dokumentatioun fir BD6387EFV-E2 - Rohm Semiconductor.
Allgemeng Länner Login logistesch Zäit Referenz | ||
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Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
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Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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