EP2C70F896C6N Tech Spezifikatioune
Intel - EP2C70F896C6N technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu Intel - EP2C70F896C6N
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | Intel | |
| Voltage - Supply | 1.15V ~ 1.25V | |
| Total RAM Bits | 1152000 | |
| Supplier Device Package | 896-FBGA (31x31) | |
| Serie | Cyclone® II | |
| Package / Case | 896-BGA | |
| Package protegéieren | Tray |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Operatioun Temperatur | 0°C ~ 85°C (TJ) | |
| Unzuel vun Logikelementer / Zellen | 68416 | |
| Zuel vu LAB / CLB | 4276 | |
| Zuel vun I / O | 622 | |
| Mounting Type | Surface Mount | |
| Basis Produktnummer | EP2C70 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu Intel EP2C70F896C6N.
| Produktiounsattriff |  |
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|---|---|---|---|---|
| Part Number | EP2C70F896C6N | EP2C70F672I8N | EP2C70F896C8N | EP2C70F896I8N |
| Hiersteller | Intel | Intel | Intel | Intel |
| Basis Produktnummer | EP2C70 | EP2C70 | EP2C70 | EP2C70 |
| Zuel vun I / O | 622 | 422 | 622 | 622 |
| Package protegéieren | Tray | Tray | Tray | Tray |
| Total RAM Bits | 1152000 | 1152000 | 1152000 | 1152000 |
| Supplier Device Package | 896-FBGA (31x31) | 672-FBGA (27x27) | 896-FBGA (31x31) | 896-FBGA (31x31) |
| Unzuel vun Logikelementer / Zellen | 68416 | 68416 | 68416 | 68416 |
| Package / Case | 896-BGA | 672-BGA | 896-BGA | 896-BGA |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Voltage - Supply | 1.15V ~ 1.25V | 1.15V ~ 1.25V | 1.15V ~ 1.25V | 1.15V ~ 1.25V |
| Operatioun Temperatur | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) | 0°C ~ 85°C (TJ) | -40°C ~ 100°C (TJ) |
| Zuel vu LAB / CLB | 4276 | 4276 | 4276 | 4276 |
| Serie | Cyclone® II | Cyclone® II | Cyclone® II | Cyclone® II |
Eroflueden EP2C70F896C6N PDF DataDhusts an Intel Dokumentatioun fir EP2C70F896C6N - Intel.
EP2C70F672I8NIntelIC FPGA 422 I/O 672FBGAEP2C70F896C8NIntelIC FPGA 622 I/O 896FBGAEP2C70F896I8NIntelIC FPGA 622 I/O 896FBGAEP2C70F896C6IntelIC FPGA 622 I/O 896FBGA
EP2C70F896I7N
EP2C8AF256A7NIntelIC FPGA 182 I/O 256FBGAEP2C70F672I8IntelIC FPGA 422 I/O 672FBGA
EP2C70F672C8KKAltera (Intel)EP2C70F672C6NIntelIC FPGA 422 I/O 672FBGAEP2C8020818NAltera (Intel)EP2C70F672C7IntelIC FPGA 422 I/O 672FBGAEP2C70F672C7NIntelIC FPGA 422 I/O 672FBGAEP2C70F896C8IntelIC FPGA 622 I/O 896FBGAEP2C70F896C7NIntelIC FPGA 622 I/O 896FBGAEP2C70F672C8NIntelIC FPGA 422 I/O 672FBGAEP2C70F896I8IntelIC FPGA 622 I/O 896FBGAEP2C70F672C8IntelIC FPGA 422 I/O 672FBGAEP2C70F896C7IntelIC FPGA 622 I/O 896FBGA| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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