GD25LQ32ENIGR Tech Spezifikatioune
GigaDevice Semiconductor (HK) Limited - GD25LQ32ENIGR technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu GigaDevice Semiconductor (HK) Limited - GD25LQ32ENIGR
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | GigaDevice | |
Schreiwe Cycle Time - Word, Page | 60µs, 2.4ms | |
Voltage - Supply | 1.65V ~ 2V | |
Technologie | FLASH - NOR | |
Supplier Device Package | 8-USON (4x3) | |
Serie | - | |
Package / Case | 8-UDFN Exposed Pad | |
Package protegéieren | Tape & Reel (TR) | |
Operatioun Temperatur | -40°C ~ 85°C (TA) |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Mounting Type | Surface Mount | |
Gedächtnis Type | Non-Volatile | |
Späichergréisst | 32Mbit | |
Erënnerungsorganisatioun | 4M x 8 | |
Memory Interface | SPI - Quad I/O, QPI | |
Memory Format | FLASH | |
Clock Frequency | 133 MHz | |
Basis Produktnummer | GD25LQ32 | |
Zougangszäit | 7 ns |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu GigaDevice Semiconductor (HK) Limited GD25LQ32ENIGR.
Produktiounsattriff | ||||
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Part Number | GD25LQ32ENIGR | GD25LQ32DLIGR | GD25LQ32ESIGR | GD25LQ32DWIGR |
Hiersteller | GigaDevice Semiconductor (HK) Limited | GigaDevice Semiconductor (HK) Limited | GigaDevice Semiconductor (HK) Limited | GigaDevice Semiconductor (HK) Limited |
Supplier Device Package | 8-USON (4x3) | 10-WLCSP | 8-SOP | 8-WSON (5x6) |
Voltage - Supply | 1.65V ~ 2V | 1.65V ~ 2V | 1.65V ~ 2V | 1.65V ~ 2V |
Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
Clock Frequency | 133 MHz | 120 MHz | 133 MHz | 120 MHz |
Technologie | FLASH - NOR | FLASH - NOR | FLASH - NOR | FLASH - NOR |
Basis Produktnummer | GD25LQ32 | GD25LQ32 | GD25LQ32 | GD25LQ32 |
Memory Format | FLASH | FLASH | FLASH | FLASH |
Serie | - | - | - | - |
Erënnerungsorganisatioun | 4M x 8 | 4M x 8 | 4M x 8 | 4M x 8 |
Memory Interface | SPI - Quad I/O, QPI | SPI - Quad I/O | SPI - Quad I/O, QPI | SPI - Quad I/O |
Gedächtnis Type | Non-Volatile | Non-Volatile | Non-Volatile | Non-Volatile |
Späichergréisst | 32Mbit | 32Mbit | 32Mbit | 32Mbit |
Package / Case | 8-UDFN Exposed Pad | 10-XFBGA, WLCSP | 8-SOIC (0.209", 5.30mm Width) | 8-WDFN Exposed Pad |
Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Schreiwe Cycle Time - Word, Page | 60µs, 2.4ms | 2.4ms | 60µs, 2.4ms | 2.4ms |
Package protegéieren | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) |
Zougangszäit | 7 ns | - | 7 ns | - |
Eroflueden GD25LQ32ENIGR PDF DataDhusts an GigaDevice Semiconductor (HK) Limited Dokumentatioun fir GD25LQ32ENIGR - GigaDevice Semiconductor (HK) Limited.
Allgemeng Länner Login logistesch Zäit Referenz | ||
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Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
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Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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