GD25LQ16C8IGR Tech Spezifikatioune
GigaDevice Semiconductor (HK) Limited - GD25LQ16C8IGR technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu GigaDevice Semiconductor (HK) Limited - GD25LQ16C8IGR
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | GigaDevice | |
Schreiwe Cycle Time - Word, Page | 50µs, 2.4ms | |
Voltage - Supply | 1.65V ~ 2.1V | |
Technologie | FLASH - NOR | |
Supplier Device Package | 8-LGA | |
Serie | - | |
Package / Case | 8-XFLGA Exposed Pad | |
Package protegéieren | Tape & Reel (TR) | |
Operatioun Temperatur | -40°C ~ 85°C (TA) |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Mounting Type | Surface Mount | |
Gedächtnis Type | Non-Volatile | |
Späichergréisst | 16Mbit | |
Erënnerungsorganisatioun | 2M x 8 | |
Memory Interface | SPI - Quad I/O | |
Memory Format | FLASH | |
Clock Frequency | 104 MHz | |
Basis Produktnummer | GD25LQ16 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu GigaDevice Semiconductor (HK) Limited GD25LQ16C8IGR.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | GD25LQ16C8IGR | GD25LQ128DSIG | GD25LQ20CEIGR | GD25LQ128ESIGR |
Hiersteller | GigaDevice Semiconductor (HK) Limited | GigaDevice Semiconductor (HK) Limited | GigaDevice Semiconductor (HK) Limited | GigaDevice Semiconductor (HK) Limited |
Supplier Device Package | 8-LGA | 8-SOP | 8-USON (2x3) | 8-SOP |
Package protegéieren | Tape & Reel (TR) | Tube | Tape & Reel (TR) | Tape & Reel (TR) |
Serie | - | - | - | - |
Erënnerungsorganisatioun | 2M x 8 | 16M x 8 | 256K x 8 | 16M x 8 |
Memory Interface | SPI - Quad I/O | SPI - Quad I/O | SPI - Quad I/O | SPI - Quad I/O |
Schreiwe Cycle Time - Word, Page | 50µs, 2.4ms | 2.4ms | 50µs, 2.4ms | 60µs, 2.4ms |
Voltage - Supply | 1.65V ~ 2.1V | 1.65V ~ 2V | 1.65V ~ 2.1V | 1.65V ~ 2V |
Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Clock Frequency | 104 MHz | 120 MHz | 104 MHz | 120 MHz |
Technologie | FLASH - NOR | FLASH - NOR | FLASH - NOR | FLASH - NOR |
Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
Späichergréisst | 16Mbit | 128Mbit | 2Mbit | 128Mbit |
Basis Produktnummer | GD25LQ16 | GD25LQ128 | GD25LQ20 | GD25LQ128 |
Package / Case | 8-XFLGA Exposed Pad | 8-SOIC (0.209", 5.30mm Width) | 8-XFDFN Exposed Pad | 8-SOIC (0.209", 5.30mm Width) |
Gedächtnis Type | Non-Volatile | Non-Volatile | Non-Volatile | Non-Volatile |
Memory Format | FLASH | FLASH | FLASH | FLASH |
Eroflueden GD25LQ16C8IGR PDF DataDhusts an GigaDevice Semiconductor (HK) Limited Dokumentatioun fir GD25LQ16C8IGR - GigaDevice Semiconductor (HK) Limited.
Allgemeng Länner Login logistesch Zäit Referenz | ||
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Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
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Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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