GD25LE64CLIGR Tech Spezifikatioune
GigaDevice Semiconductor (HK) Limited - GD25LE64CLIGR technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu GigaDevice Semiconductor (HK) Limited - GD25LE64CLIGR
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | GigaDevice | |
Schreiwe Cycle Time - Word, Page | 2.4ms | |
Voltage - Supply | 1.65V ~ 2V | |
Technologie | FLASH - NOR | |
Supplier Device Package | 21-WLCSP | |
Serie | - | |
Package / Case | 21-XFBGA, WLSCP | |
Package protegéieren | Tape & Reel (TR) | |
Operatioun Temperatur | -40°C ~ 85°C (TA) |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Mounting Type | Surface Mount | |
Gedächtnis Type | Non-Volatile | |
Späichergréisst | 64Mbit | |
Erënnerungsorganisatioun | 8M x 8 | |
Memory Interface | SPI - Quad I/O | |
Memory Format | FLASH | |
Clock Frequency | 133 MHz | |
Basis Produktnummer | GD25LE64 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu GigaDevice Semiconductor (HK) Limited GD25LE64CLIGR.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | GD25LE64CLIGR | GD25LD20CEIGR | GD25LE128DLIGR | GD25LD40CTIG |
Hiersteller | GigaDevice Semiconductor (HK) Limited | GigaDevice Semiconductor (HK) Limited | GigaDevice Semiconductor (HK) Limited | GigaDevice Semiconductor (HK) Limited |
Package / Case | 21-XFBGA, WLSCP | 8-XFDFN Exposed Pad | 21-XFBGA, WLSCP | 8-SOIC (0.154", 3.90mm Width) |
Supplier Device Package | 21-WLCSP | 8-USON (2x3) | 21-WLCSP | 8-SOP |
Späichergréisst | 64Mbit | 2Mbit | 128Mbit | 4Mbit |
Memory Format | FLASH | FLASH | FLASH | FLASH |
Schreiwe Cycle Time - Word, Page | 2.4ms | 97µs, 6ms | 2.4ms | 97µs, 6ms |
Basis Produktnummer | GD25LE64 | GD25LD20 | GD25LE128 | GD25LD40 |
Clock Frequency | 133 MHz | 50 MHz | 120 MHz | 50 MHz |
Technologie | FLASH - NOR | FLASH - NOR | FLASH - NOR | FLASH - NOR |
Voltage - Supply | 1.65V ~ 2V | 1.65V ~ 2V | 1.65V ~ 2V | 1.65V ~ 2V |
Memory Interface | SPI - Quad I/O | SPI - Dual I/O | SPI - Quad I/O | SPI - Dual I/O |
Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
Package protegéieren | Tape & Reel (TR) | Tape & Reel (TR) | Tape & Reel (TR) | Tube |
Serie | - | - | - | - |
Erënnerungsorganisatioun | 8M x 8 | 256K x 8 | 16M x 8 | 512K x 8 |
Gedächtnis Type | Non-Volatile | Non-Volatile | Non-Volatile | Non-Volatile |
Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Eroflueden GD25LE64CLIGR PDF DataDhusts an GigaDevice Semiconductor (HK) Limited Dokumentatioun fir GD25LE64CLIGR - GigaDevice Semiconductor (HK) Limited.
Allgemeng Länner Login logistesch Zäit Referenz | ||
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Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
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Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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