SPC5777CDK3MMO3 Tech Spezifikatioune
NXP USA Inc. - SPC5777CDK3MMO3 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu NXP USA Inc. - SPC5777CDK3MMO3
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | NXP Semiconductors | |
| Voltage - Versorgung (Vcc / Vdd) | 3V ~ 5.5V | |
| Supplier Device Package | 516-MAPBGA (27x27) | |
| Speed | 264MHz | |
| Serie | MPC57xx | |
| RAM Gréisst | 512K x 8 | |
| Programm Memory Type | FLASH | |
| Programmspeichergréisst | 8MB (8M x 8) | |
| Peripheralien | DMA, LVD, POR, Zipwire | |
| Package / Case | 516-BGA |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Package protegéieren | Tray | |
| Oszilléierertyp | Internal | |
| Operatioun Temperatur | -40°C ~ 125°C (TA) | |
| Mounting Type | Surface Mount | |
| EEPROM Gréisst | - | |
| Datenkonverter | A/D 16b Sigma-Delta, eQADC | |
| Core Size | 32-Bit Tri-Core | |
| Core Prozessor | e200z7 | |
| Konnektivitéit | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | |
| Basis Produktnummer | SPC5777 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu NXP USA Inc. SPC5777CDK3MMO3.
| Produktiounsattriff |  |
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|---|---|---|---|---|
| Part Number | SPC5777CDK3MMO3 | SPC5777CCK3MME3 | SPC5777CLK3MMO3R | SPC582B50E3CD00X |
| Hiersteller | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. | STMicroelectronics |
| Datenkonverter | A/D 16b Sigma-Delta, eQADC | A/D 16b Sigma-Delta, eQADC | A/D 16b Sigma-Delta, eQADC | A/D 27x12b SAR |
| Serie | MPC57xx | MPC57xx | MPC57xx | Automotive, AEC-Q100, SPC58 2B-Line |
| Peripheralien | DMA, LVD, POR, Zipwire | DMA, LVD, POR, Zipwire | DMA, LVD, POR, Zipwire | DMA, WDT |
| Operatioun Temperatur | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) |
| Basis Produktnummer | SPC5777 | SPC5777 | SPC5777 | SPC582 |
| Speed | 264MHz | 264MHz | 264MHz | 80MHz |
| Programm Memory Type | FLASH | FLASH | FLASH | FLASH |
| Oszilléierertyp | Internal | Internal | Internal | Internal |
| Package / Case | 516-BGA | 416-BGA | 516-BGA | 100-TQFP Exposed Pad |
| Supplier Device Package | 516-MAPBGA (27x27) | 416-MAPBGA (27x27) | 516-MAPBGA (27x27) | 100-eTQFP (14x14) |
| Core Size | 32-Bit Tri-Core | 32-Bit Tri-Core | 32-Bit Tri-Core | 32-Bit Single-Core |
| Package protegéieren | Tray | Tray | Tape & Reel (TR) | Tape & Reel (TR) |
| Programmspeichergréisst | 8MB (8M x 8) | 8MB (8M x 8) | 8MB (8M x 8) | 512KB (512K x 8) |
| EEPROM Gréisst | - | - | - | 64K x 8 |
| Voltage - Versorgung (Vcc / Vdd) | 3V ~ 5.5V | 3V ~ 5.5V | 3V ~ 5.5V | 3.3V, 5V |
| Konnektivitéit | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI | CANbus, I²C, LINbus, SPI |
| Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
| Core Prozessor | e200z7 | e200z7 | e200z7 | e200z2 |
| RAM Gréisst | 512K x 8 | 512K x 8 | 512K x 8 | 96K x 8 |
Eroflueden SPC5777CDK3MMO3 PDF DataDhusts an NXP USA Inc. Dokumentatioun fir SPC5777CDK3MMO3 - NXP USA Inc..
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|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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