SPC5775BDK3MME2R Tech Spezifikatioune
NXP USA Inc. - SPC5775BDK3MME2R technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu NXP USA Inc. - SPC5775BDK3MME2R
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Hiersteller | NXP Semiconductors | |
| Voltage - Versorgung (Vcc / Vdd) | 3V, 5.5V | |
| Supplier Device Package | 416-MAPBGA (27x27) | |
| Speed | 220MHz | |
| Serie | MPC57xx | |
| RAM Gréisst | 512K x 8 | |
| Programm Memory Type | FLASH | |
| Programmspeichergréisst | 4MB (4M x 8) | |
| Peripheralien | DMA, LVD, POR, Zipwire | |
| Package / Case | 416-BGA |
| Produktiounsattriff | Attributer Wäert | |
|---|---|---|
| Package protegéieren | Tape & Reel (TR) | |
| Oszilléierertyp | Internal | |
| Operatioun Temperatur | -40°C ~ 125°C (TA) | |
| Mounting Type | Surface Mount | |
| EEPROM Gréisst | - | |
| Datenkonverter | - | |
| Core Size | 32-Bit Dual-Core | |
| Core Prozessor | e200z7 | |
| Konnektivitéit | CANbus, EBI/EMI, Ethernet, FlexRay, LINbus, SPI, PSI, UART/USART | |
| Basis Produktnummer | SPC5775 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu NXP USA Inc. SPC5775BDK3MME2R.
| Produktiounsattriff |  |
 |
 |
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|---|---|---|---|---|
| Part Number | SPC5775BDK3MME2R | SPC5775KK2MMY3A | SPC574S64E3CEFAR | SPC5777CCK3MME3 |
| Hiersteller | NXP USA Inc. | NXP USA Inc. | STMicroelectronics | NXP USA Inc. |
| Programmspeichergréisst | 4MB (4M x 8) | - | 1.5MB (1.5M x 8) | 8MB (8M x 8) |
| Core Size | 32-Bit Dual-Core | - | 32-Bit Dual-Core | 32-Bit Tri-Core |
| Programm Memory Type | FLASH | - | FLASH | FLASH |
| Package / Case | 416-BGA | - | 100-TQFP Exposed Pad | 416-BGA |
| Voltage - Versorgung (Vcc / Vdd) | 3V, 5.5V | - | 3.135V ~ 5.25V | 3V ~ 5.5V |
| Mounting Type | Surface Mount | - | Surface Mount | Surface Mount |
| RAM Gréisst | 512K x 8 | - | 96K x 8 | 512K x 8 |
| Core Prozessor | e200z7 | - | e200z4 | e200z7 |
| Operatioun Temperatur | -40°C ~ 125°C (TA) | - | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) |
| Konnektivitéit | CANbus, EBI/EMI, Ethernet, FlexRay, LINbus, SPI, PSI, UART/USART | - | CANbus, FlexRay, LINbus, SPI, UART/USART | CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI |
| Peripheralien | DMA, LVD, POR, Zipwire | - | DMA, LVD, POR, WDT | DMA, LVD, POR, Zipwire |
| Basis Produktnummer | SPC5775 | SPC5775 | SPC574 | SPC5777 |
| Supplier Device Package | 416-MAPBGA (27x27) | - | 100-eTQFP (14x14) | 416-MAPBGA (27x27) |
| Package protegéieren | Tape & Reel (TR) | Box | Tape & Reel (TR) | Tray |
| Serie | MPC57xx | * | - | MPC57xx |
| Speed | 220MHz | - | 140MHz | 264MHz |
| Oszilléierertyp | Internal | - | Internal | Internal |
| EEPROM Gréisst | - | - | 64K x 8 | - |
| Datenkonverter | - | - | - | A/D 16b Sigma-Delta, eQADC |
Eroflueden SPC5775BDK3MME2R PDF DataDhusts an NXP USA Inc. Dokumentatioun fir SPC5775BDK3MME2R - NXP USA Inc..
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SPC5748GSK1MKU6NXP USA Inc.IC MCU 32BIT 6MB FLASH 176LQFPSPC5748GSK1MMJ6NXP USA Inc.IC MCU 32BIT 6MB FLSH 256MAPPBGASPC5748GSMMJ6Freescale SemiconductorSPC5748GSK1MMJ6RSPC5775BDK3MME2NXP SemiconductorsSPC5777CDK3MME3NXP SemiconductorsSPC574K72E7NASPC5775EDK3MME3NXP SemiconductorsSPC5777CCK3MMO3NXP SemiconductorsSPC5775KK2MMY3ARNXP USA Inc.IC 4M FLASH 1.5M RAM 356MAPBGA| Allgemeng Länner Login logistesch Zäit Referenz | ||
|---|---|---|
| Regioun | Landunance | Logistesch Zäit (Dag) |
| Amerika | Vereenegt Staaten | 5- |
| Brasilien | 7 | |
| Europa | Däitschland | 5- |
| Vereenegt Kinnekräich | 4 | |
| Italien | 5- | |
| Oceania | Australien | 6 |
| Neiséiland | 5- | |
| Asien | Indien | 4 |
| Japan | 4 | |
| Mettleren Osten | Israel | 6 |
| DHL & FEDEX Sendung Käschten Referenz | |
|---|---|
| Liwwerung Käschten (kg) | Referenz DHL (USD $) |
| 0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
| 1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
| 2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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