SPC5566MZP112R Tech Spezifikatioune
NXP USA Inc. - SPC5566MZP112R technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu NXP USA Inc. - SPC5566MZP112R
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | NXP Semiconductors | |
Voltage - Versorgung (Vcc / Vdd) | 1.35V ~ 1.65V | |
Supplier Device Package | 416-PBGA (27x27) | |
Speed | 112MHz | |
Serie | MPC55xx Qorivva | |
RAM Gréisst | 128K x 8 | |
Programm Memory Type | FLASH | |
Programmspeichergréisst | 3MB (3M x 8) | |
Peripheralien | DMA, POR, PWM, WDT | |
Package / Case | 416-BBGA | |
Package protegéieren | Tape & Reel (TR) |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Oszilléierertyp | External | |
Operatioun Temperatur | -40°C ~ 125°C (TA) | |
Zuel vun I / O | 256 | |
Mounting Type | Surface Mount | |
EEPROM Gréisst | - | |
Datenkonverter | A/D 40x12b | |
Core Size | 32-Bit Single-Core | |
Core Prozessor | e200z6 | |
Konnektivitéit | CANbus, EBI/EMI, Ethernet, SCI, SPI | |
Basis Produktnummer | SPC5566 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu NXP USA Inc. SPC5566MZP112R.
Produktiounsattriff | ||||
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Part Number | SPC5566MZP112R | SPC5601DF1VLH4 | SPC5566MZP80R | SPC5567MVZ132 |
Hiersteller | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. | NXP Semiconductors |
Operatioun Temperatur | -40°C ~ 125°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 125°C (TA) | - |
Peripheralien | DMA, POR, PWM, WDT | DMA, POR, PWM, WDT | DMA, POR, PWM, WDT | - |
Package / Case | 416-BBGA | 64-LQFP | 416-BBGA | - |
Mounting Type | Surface Mount | Surface Mount | Surface Mount | - |
Programmspeichergréisst | 3MB (3M x 8) | 128KB (128K x 8) | 3MB (3M x 8) | - |
Serie | MPC55xx Qorivva | MPC56xx Qorivva | MPC55xx Qorivva | - |
EEPROM Gréisst | - | 4K x 16 | - | - |
Package protegéieren | Tape & Reel (TR) | Tray | Tape & Reel (TR) | - |
Supplier Device Package | 416-PBGA (27x27) | 64-LQFP (10x10) | 416-PBGA (27x27) | - |
Programm Memory Type | FLASH | FLASH | FLASH | - |
Konnektivitéit | CANbus, EBI/EMI, Ethernet, SCI, SPI | CANbus, LINbus, SCI, SPI | CANbus, EBI/EMI, Ethernet, SCI, SPI | - |
Basis Produktnummer | SPC5566 | SPC5601 | SPC5566 | - |
Zuel vun I / O | 256 | 45 | 256 | - |
Core Prozessor | e200z6 | e200z0h | e200z6 | - |
Oszilléierertyp | External | Internal | External | - |
Speed | 112MHz | 48MHz | 80MHz | - |
RAM Gréisst | 128K x 8 | 12K x 8 | 128K x 8 | - |
Datenkonverter | A/D 40x12b | A/D 16x12b | A/D 40x12b | - |
Core Size | 32-Bit Single-Core | 32-Bit Single-Core | 32-Bit Single-Core | - |
Voltage - Versorgung (Vcc / Vdd) | 1.35V ~ 1.65V | 3V ~ 5.5V | 1.35V ~ 1.65V | - |
Eroflueden SPC5566MZP112R PDF DataDhusts an NXP USA Inc. Dokumentatioun fir SPC5566MZP112R - NXP USA Inc..
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
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Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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