SPC5516EBMLQ66 Tech Spezifikatioune
NXP USA Inc. - SPC5516EBMLQ66 technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu NXP USA Inc. - SPC5516EBMLQ66
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | NXP Semiconductors | |
Voltage - Versorgung (Vcc / Vdd) | 4.5V ~ 5.25V | |
Supplier Device Package | 144-LQFP (20x20) | |
Speed | 66MHz | |
Serie | MPC55xx Qorivva | |
RAM Gréisst | 64K x 8 | |
Programm Memory Type | FLASH | |
Programmspeichergréisst | 1MB (1M x 8) | |
Peripheralien | DMA, POR, PWM, WDT | |
Package / Case | 144-LQFP | |
Package protegéieren | Tray |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Oszilléierertyp | Internal | |
Operatioun Temperatur | -40°C ~ 125°C (TA) | |
Zuel vun I / O | 111 | |
Mounting Type | Surface Mount | |
EEPROM Gréisst | - | |
Datenkonverter | A/D 40x12b | |
Core Size | 32-Bit Dual-Core | |
Core Prozessor | e200z0, e200z1 | |
Konnektivitéit | CANbus, EBI/EMI, I²C, SCI, SPI | |
Basis Produktnummer | SPC5516 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu NXP USA Inc. SPC5516EBMLQ66.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | SPC5516EBMLQ66 | SPC5534MVM80R | SPC5517SAMLU66 | SPC5517SAMLU66 |
Hiersteller | NXP USA Inc. | NXP USA Inc. | NXP USA Inc. | Freescale Semiconductor |
Package / Case | 144-LQFP | 208-BGA | 176-LQFP | 176-LQFP |
Serie | MPC55xx Qorivva | MPC55xx Qorivva | MPC55xx Qorivva | MPC55xx Qorivva |
Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Peripheralien | DMA, POR, PWM, WDT | DMA, POR, PWM, WDT | DMA, POR, PWM, WDT | DMA, POR, PWM, WDT |
Voltage - Versorgung (Vcc / Vdd) | 4.5V ~ 5.25V | 1.35V ~ 1.65V | 4.5V ~ 5.25V | 4.5V ~ 5.25V |
Datenkonverter | A/D 40x12b | A/D 34x12b | A/D 40x12b | A/D 40x12b |
RAM Gréisst | 64K x 8 | 64K x 8 | 64K x 8 | 64K x 8 |
Zuel vun I / O | 111 | 192 | 137 | 137 |
Basis Produktnummer | SPC5516 | SPC5534 | SPC5517 | SPC5517 |
Programmspeichergréisst | 1MB (1M x 8) | 1MB (1M x 8) | 1.5MB (1.5M x 8) | 1.5MB (1.5M x 8) |
Core Prozessor | e200z0, e200z1 | e200z6 | e200z1 | e200z1 |
Package protegéieren | Tray | Tape & Reel (TR) | Tray | Bulk |
Oszilléierertyp | Internal | External | Internal | Internal |
Core Size | 32-Bit Dual-Core | 32-Bit Single-Core | 32-Bit Single-Core | 32-Bit Single-Core |
Supplier Device Package | 144-LQFP (20x20) | 208-BGA (17x17) | 176-LQFP (24x24) | 176-LQFP (24x24) |
Programm Memory Type | FLASH | FLASH | FLASH | FLASH |
Speed | 66MHz | 80MHz | 66MHz | 66MHz |
Konnektivitéit | CANbus, EBI/EMI, I²C, SCI, SPI | CANbus, EBI/EMI, Ethernet, SCI, SPI | CANbus, EBI/EMI, I²C, SCI, SPI | CANbus, EBI/EMI, I²C, SCI, SPI |
Operatioun Temperatur | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 125°C (TA) |
EEPROM Gréisst | - | - | - | - |
Eroflueden SPC5516EBMLQ66 PDF DataDhusts an NXP USA Inc. Dokumentatioun fir SPC5516EBMLQ66 - NXP USA Inc..
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
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Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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