S9S12GN16F0MLF Tech Spezifikatioune
NXP USA Inc. - S9S12GN16F0MLF technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu NXP USA Inc. - S9S12GN16F0MLF
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Hiersteller | NXP Semiconductors | |
Voltage - Versorgung (Vcc / Vdd) | 3.13V ~ 5.5V | |
Supplier Device Package | 48-LQFP (7x7) | |
Speed | 25MHz | |
Serie | HCS12 | |
RAM Gréisst | 1K x 8 | |
Programm Memory Type | FLASH | |
Programmspeichergréisst | 16KB (16K x 8) | |
Peripheralien | LVD, POR, PWM, WDT | |
Package / Case | 48-LQFP | |
Package protegéieren | Tray |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Oszilléierertyp | Internal | |
Operatioun Temperatur | -40°C ~ 125°C | |
Zuel vun I / O | 40 | |
Mounting Type | Surface Mount | |
EEPROM Gréisst | 512 x 8 | |
Datenkonverter | A/D 8x10b | |
Core Size | 16-Bit | |
Core Prozessor | 12V1 | |
Konnektivitéit | IrDA, LINbus, SCI, SPI | |
Basis Produktnummer | S9S12 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu NXP USA Inc. S9S12GN16F0MLF.
Produktiounsattriff | ||||
---|---|---|---|---|
Part Number | S9S12GN16F0MLF | S9S12GN16F1CLC | S9S12GN16F1VLC | S9S12GN16F1VLC |
Hiersteller | NXP USA Inc. | NXP USA Inc. | Freescale Semiconductor | NXP USA Inc. |
Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Programmspeichergréisst | 16KB (16K x 8) | 16KB (16K x 8) | 16KB (16K x 8) | 16KB (16K x 8) |
Konnektivitéit | IrDA, LINbus, SCI, SPI | IrDA, LINbus, SCI, SPI | IrDA, LINbus, SCI, SPI | IrDA, LINbus, SCI, SPI |
Oszilléierertyp | Internal | Internal | Internal | Internal |
Package / Case | 48-LQFP | 32-LQFP | 32-LQFP | 32-LQFP |
Zuel vun I / O | 40 | 26 | 26 | 26 |
Peripheralien | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT |
Basis Produktnummer | S9S12 | S9S12 | S9S12 | S9S12 |
Datenkonverter | A/D 8x10b | A/D 8x10b | A/D 8x10b | A/D 8x10b |
Speed | 25MHz | 25MHz | 25MHz | 25MHz |
Voltage - Versorgung (Vcc / Vdd) | 3.13V ~ 5.5V | 3.13V ~ 5.5V | 3.13V ~ 5.5V | 3.13V ~ 5.5V |
EEPROM Gréisst | 512 x 8 | 512 x 8 | 512 x 8 | 512 x 8 |
Core Size | 16-Bit | 16-Bit | 16-Bit | 16-Bit |
Programm Memory Type | FLASH | FLASH | FLASH | FLASH |
Operatioun Temperatur | -40°C ~ 125°C | -40°C ~ 85°C (TA) | -40°C ~ 105°C (TA) | -40°C ~ 105°C (TA) |
Serie | HCS12 | HCS12 | HCS12 | HCS12 |
RAM Gréisst | 1K x 8 | 1K x 8 | 1K x 8 | 1K x 8 |
Core Prozessor | 12V1 | 12V1 | 12V1 | 12V1 |
Supplier Device Package | 48-LQFP (7x7) | 32-LQFP (7x7) | 32-LQFP (7x7) | 32-LQFP (7x7) |
Package protegéieren | Tray | Tray | Bulk | Tray |
Eroflueden S9S12GN16F0MLF PDF DataDhusts an NXP USA Inc. Dokumentatioun fir S9S12GN16F0MLF - NXP USA Inc..
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
---|---|
Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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