S9S08SG32E1CTJR Tech Spezifikatioune
NXP USA Inc. - S9S08SG32E1CTJR technesch Spezifikatioune, Attributer, Parameteren an Deeler mat ähnleche Spezifikatioune zu NXP USA Inc. - S9S08SG32E1CTJR
Produktiounsattriff | Attributer Wäert | |
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Hiersteller | NXP Semiconductors | |
Voltage - Versorgung (Vcc / Vdd) | 2.7V ~ 5.5V | |
Supplier Device Package | 20-TSSOP | |
Speed | 40MHz | |
Serie | S08 | |
RAM Gréisst | 1K x 8 | |
Programm Memory Type | FLASH | |
Programmspeichergréisst | 32KB (32K x 8) | |
Peripheralien | LVD, POR, PWM, WDT | |
Package / Case | 20-TSSOP (0.173', 4.40mm Width) | |
Package protegéieren | Tape & Reel (TR) |
Produktiounsattriff | Attributer Wäert | |
---|---|---|
Oszilléierertyp | Internal | |
Operatioun Temperatur | -40°C ~ 85°C (TA) | |
Zuel vun I / O | 16 | |
Mounting Type | Surface Mount | |
EEPROM Gréisst | - | |
Datenkonverter | A/D 12x10b | |
Core Size | 8-Bit | |
Core Prozessor | S08 | |
Konnektivitéit | I²C, LINbus, SCI, SPI | |
Basis Produktnummer | S9S08 |
Déi dräi Deeler op der richteger hunn ähnlech Spezifikatioune zu NXP USA Inc. S9S08SG32E1CTJR.
Produktiounsattriff | ||||
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Part Number | S9S08SG32E1CTJR | S9S08SG32E1MTJ | S9S08SG32E1CTG | S9S08SG32E1CTJ |
Hiersteller | NXP USA Inc. | NXP USA Inc. | Freescale Semiconductor | NXP USA Inc. |
Operatioun Temperatur | -40°C ~ 85°C (TA) | -40°C ~ 125°C (TA) | -40°C ~ 85°C (TA) | -40°C ~ 85°C (TA) |
Programmspeichergréisst | 32KB (32K x 8) | 32KB (32K x 8) | 32KB (32K x 8) | 32KB (32K x 8) |
Mounting Type | Surface Mount | Surface Mount | Surface Mount | Surface Mount |
Voltage - Versorgung (Vcc / Vdd) | 2.7V ~ 5.5V | 2.7V ~ 5.5V | 2.7V ~ 5.5V | 2.7V ~ 5.5V |
Datenkonverter | A/D 12x10b | A/D 12x10b | A/D 8x10b | A/D 12x10b |
Programm Memory Type | FLASH | FLASH | FLASH | FLASH |
EEPROM Gréisst | - | - | - | - |
Supplier Device Package | 20-TSSOP | 20-TSSOP | 16-TSSOP | 20-TSSOP |
Basis Produktnummer | S9S08 | S9S08 | S9S08 | S9S08 |
Oszilléierertyp | Internal | Internal | Internal | Internal |
Core Prozessor | S08 | S08 | S08 | S08 |
Peripheralien | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT | LVD, POR, PWM, WDT |
Konnektivitéit | I²C, LINbus, SCI, SPI | I²C, LINbus, SCI, SPI | I²C, LINbus, SCI, SPI | I²C, LINbus, SCI, SPI |
Serie | S08 | S08 | S08 | S08 |
Zuel vun I / O | 16 | 16 | 12 | 16 |
Package protegéieren | Tape & Reel (TR) | Tube | Bulk | Tube |
Core Size | 8-Bit | 8-Bit | 8-Bit | 8-Bit |
Speed | 40MHz | 40MHz | 40MHz | 40MHz |
RAM Gréisst | 1K x 8 | 1K x 8 | 1K x 8 | 1K x 8 |
Package / Case | 20-TSSOP (0.173', 4.40mm Width) | 20-TSSOP (0.173', 4.40mm Width) | 16-TSSOP (0.173", 4.40mm Width) | 20-TSSOP (0.173", 4.40mm Width) |
Eroflueden S9S08SG32E1CTJR PDF DataDhusts an NXP USA Inc. Dokumentatioun fir S9S08SG32E1CTJR - NXP USA Inc..
Allgemeng Länner Login logistesch Zäit Referenz | ||
---|---|---|
Regioun | Landunance | Logistesch Zäit (Dag) |
Amerika | Vereenegt Staaten | 5- |
Brasilien | 7 | |
Europa | Däitschland | 5- |
Vereenegt Kinnekräich | 4 | |
Italien | 5- | |
Oceania | Australien | 6 |
Neiséiland | 5- | |
Asien | Indien | 4 |
Japan | 4 | |
Mettleren Osten | Israel | 6 |
DHL & FEDEX Sendung Käschten Referenz | |
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Liwwerung Käschten (kg) | Referenz DHL (USD $) |
0.00kg-1,00 kg | USD $ 30,00 - USD $ 60,00 |
1.00kg-2.00 kg | USD $ 40,00 - USD $ 80,00 |
2.00kg-3.00 kg | USD $ 50,00 - USD $ 100,00 |
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